Chemicals are best recognized by their unique wavelength specific optical absorption signatures in the molecular fingerprint region from λ=3-15μm. In recent years, photonic devices on chips are increasingly being used for chemical and biological sensing. Silicon has been the material of choice of the photonics industry over the last decade due to its easy integration with silicon electronics as well as its optical transparency in the near-infrared telecom wavelengths. Silicon is optically transparent from 1.1 μm to 8 μm with research from several groups in the mid-IR. However, intrinsic material losses in silicon exceed 2dB/cm after λ~7μm (~0.25dB/cm at λ=6μm). In addition to the waveguiding core, an appropriate transparent cladding is also required. Available core-cladding choices such as Ge-GaAs, GaAs-AlGaAs, InGaAs-InP would need suspended membrane photonic crystal waveguide geometries. However, since the most efficient QCLs demonstrated are in the InP platform, the choice of InGaAs-InP eliminates need for wafer bonding versus other choices. The InGaAs-InP material platform can also potentially cover the entire molecular fingerprint region from λ=3-15μm. At long wavelengths, in monolithic architectures integrating lasers, detectors and passive sensor photonic components without wafer bonding, compact passive photonic integrated circuit (PIC) components are desirable to reduce expensive epi material loss in passive PIC etched areas. In this paper, we consider miniaturization of waveguide bends and polarization rotators. We experimentally demonstrate suspended membrane subwavelength waveguide bends with compact sub-50μm bend radius and compact sub-300μm long polarization rotators in the InGaAs/InP material system. Measurements are centered at λ=6.15μm for sensing ammonia
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Guided Mid‐IR and Near‐IR Light within a Hybrid Hyperbolic‐Material/Silicon Waveguide Heterostructure
Silicon waveguides have enabled large‐scale manipulation and processing of near‐infrared optical signals on chip. Yet, expanding the bandwidth of guided waves to other frequencies will further increase the functionality of silicon as a photonics platform. Frequency multiplexing by integrating additional architectures is one approach to the problem, but this is challenging to design and integrate within the existing form factor due to scaling with the free‐space wavelength. This paper demonstrates that a hexagonal boron nitride (hBN)/silicon hybrid waveguide can simultaneously enable dual‐band operation at both mid‐infrared (6.5–7.0 µm) and telecom (1.55 µm) frequencies, respectively. The device is realized via the lithography‐free transfer of hBN onto a silicon waveguide, maintaining near‐infrared operation. In addition, mid‐infrared waveguiding of the hyperbolic phonon polaritons (HPhPs) supported in hBN is induced by the index contrast between the silicon waveguide and the surrounding air underneath the hBN, thereby eliminating the need for deleterious etching of the hyperbolic medium. The behavior of HPhP waveguiding in both straight and curved trajectories is validated within an analytical waveguide theoretical framework. This exemplifies a generalizable approach based on integrating hyperbolic media with silicon photonics for realizing frequency multiplexing in on‐chip photonic systems.
more » « less- Award ID(s):
- 1809937
- NSF-PAR ID:
- 10452543
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials
- Volume:
- 33
- Issue:
- 11
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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