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Abstract Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the plastic substrate from a carrier without damaging the electronics remains challenging. Here we utilize a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer films from rigid carriers. PLO uses a 150 µs pulse of broadband light from flashlamps to lift-off functional thin films from glass carrier substrates coated with a light absorber layer (LAL). Modeling indicates that the polymer/LAL interface reaches above 800 °C during PLO, but the top surface of the PI remains below 120 °C. An array of indium zinc oxide (IZO) thin-film transistors (TFTs) was fabricated on a polyimide substrate and photonically lifted off from the glass carrier. The TFT mobility was unchanged by PLO. The flexible TFTs were mechanically robust, with no reduction in mobility while flexed.
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Photonic Lift-off Process to Fabricate Ultrathin Flexible Solar Cells
A microsecond time-scale photonic lift-off (PLO) process was used to fabricate mechanically flexible photovoltaic devices (PVs) with a total thickness of less than 20 μm. PLO is a rapid, scalable photothermal technique for processing extremely thin, mechanically flexible electronic and optoelectronic devices. PLO is also compatible with large-area devices, roll-to-roll processing, and substrates with low temperature compatibility. As a proof of concept, PVs were fabricated using CuInSe2 nanocrystal ink deposited at room temperature under ambient conditions on thin, plastic substrates heated to 100 °C. It was necessary to prevent cracking of the brittle top contact layer of indium tin oxide (ITO) during lift-off, either by using a layer of silver nanowires (AgNW) as the top contact or by infusing the ITO layer with AgNW. This approach could generally be used to improve the mechanical versatility of current collectors in a variety of ultrathin electronic and optoelectronic devices requiring a transparent conductive contact layer.
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- Award ID(s):
- 1822206
- PAR ID:
- 10295081
- Date Published:
- Journal Name:
- ACS applied materials interfaces
- ISSN:
- 1944-8252
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/https://doi.org/10.1021/acsami.1c12382
