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Title: Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
Award ID(s):
1934482
PAR ID:
10309991
Author(s) / Creator(s):
; ; ; ; ; ; ; ; ;
Date Published:
Journal Name:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume:
11
Issue:
8
ISSN:
2156-3950
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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