Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
- Award ID(s):
- 1934482
- Publication Date:
- NSF-PAR ID:
- 10309991
- Journal Name:
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Volume:
- 11
- Issue:
- 8
- ISSN:
- 2156-3950
- Sponsoring Org:
- National Science Foundation
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