The electrical properties of polycrystalline graphene grown by chemical vapor deposition (CVD) are determined by grain-related parameters—average grain size, single-crystalline grain sheet resistance, and grain boundary (GB) resistivity. However, extracting these parameters still remains challenging because of the difficulty in observing graphene GBs and decoupling the grain sheet resistance and GB resistivity. In this work, we developed an electrical characterization method that can extract the average grain size, single-crystalline grain sheet resistance, and GB resistivity simultaneously. We observed that the material property, graphene sheet resistance, could depend on the device dimension and developed an analytical resistance model based on the cumulative distribution function of the gamma distribution, explaining the effect of the GB density and distribution in the graphene channel. We applied this model to CVD-grown monolayer graphene by characterizing transmission-line model patterns and simultaneously extracted the average grain size (~5.95 μm), single-crystalline grain sheet resistance (~321 Ω/sq), and GB resistivity (~18.16 kΩ-μm) of the CVD-graphene layer. The extracted values agreed well with those obtained from scanning electron microscopy images of ultraviolet/ozone-treated GBs and the electrical characterization of graphene devices with sub-micrometer channel lengths.
more »
« less
Electronic transport across extended grain boundaries in graphene
Abstract Owing to its superlative carrier mobility and atomic thinness, graphene exhibits great promise for interconnects in future nanoelectronic integrated circuits. Chemical vapor deposition (CVD), the most popular method for wafer-scale growth of graphene, produces monolayers that are polycrystalline, where misoriented grains are separated by extended grain boundaries (GBs). Theoretical models of GB resistivity focused on small sections of an extended GB, assuming it to be a straight line, and predicted a strong dependence of resistivity on misorientation angle. In contrast, measurements produced values in a much narrower range and without a pronounced angle dependence. Here we study electron transport across rough GBs, which are composed of short straight segments connected together into an extended GB. We found that, due to the zig-zag nature of rough GBs, there always exist a few segments that divide the crystallographic angle between two grains symmetrically and provide a highly conductive path for the current to flow across the GBs. The presence of highly conductive segments produces resistivity between 10 2 to 10 4 Ω μ m regardless of misorientation angle. An extended GB with large roughness and small correlation length has small resistivity on the order of 10 3 Ω μ m, even for highly mismatched asymmetric GBs. The effective slope of the GB, given by the ratio of roughness and lateral correlation length, is an effective universal quantifier for GB resistivity. Our results demonstrate that the probability of finding conductive segments diminishes in short GBs, which could cause a large variation in the resistivity of narrow ribbons etched from polycrystalline graphene. We also uncover spreading resistance due to the current bending in the grains to flow through the conductive segments of the GB and show that it scales linearly with the grain resistance. Our results will be crucial for designing graphene-based interconnects for future integrated circuits.
more »
« less
- Award ID(s):
- 1902352
- PAR ID:
- 10321280
- Date Published:
- Journal Name:
- Nano Express
- Volume:
- 2
- Issue:
- 3
- ISSN:
- 2632-959X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Nanostructured steels are expected to have enhanced irradiation tolerance and improved strength. However, they suffer from poor microstructural stability at elevated temperatures. In this study, Fe–21Cr–5Al–0.026C (wt%) Kanthal D (KD) alloy belonging to a class of (FeCrAl) alloys considered for accident‐tolerant fuel cladding in light‐water reactors is nanostructured using two severe plastic deformation techniques of equal‐channel angular pressing (ECAP) and high‐pressure torsion (HPT), and their thermal stability between 500–700 °C is studied and compared. ECAP KD is found to be thermally stable up to 500 °C, whereas HPT KD is unstable at 500 °C. Microstructural characterization reveals that ECAP KD undergoes recovery at 550 °C and recrystallization above 600 °C, while HPT KD shows continuous grain growth after annealing above 500 °C. Enhanced thermal stability of ECAP KD is from significant fraction (>50%) of low‐angle grain boundaries (GBs) (misorientation angle 2–15°) stabilizing the microstructure due to their low mobility. Small grain sizes, a high fraction (>80%) of high‐angle GBs (misorientation angle >15°) and accordingly a large amount of stored GB energy, serve as the driving force for HPT KD to undergo grain growth instead of recrystallization driven by excess stored strain energy.more » « less
-
null (Ed.)Grain growth under shear annealing is crucial for controlling the properties of polycrystalline materials. However, their microscopic kinetics are not well understood because individual atomic trajectories are difficult to track. Here, we study grain growth with single-particle kinetics in colloidal polycrystals using video microscopy. Rich grain-growth phenomena are revealed in three shear regimes, including the normal grain growth (NGG) in weak shear melting–recrystallization process in strong shear. For intermediate shear, early stage NGG is arrested by built-up stress and eventually gives way to dynamic abnormal grain growth (DAGG). We find that DAGG occurs via a melting–recrystallization process, which naturally explains the puzzling stress drop at the onset of DAGG in metals. Moreover, we visualize that grain boundary (GB) migration is coupled with shear via disconnection gliding. The disconnection-gliding dynamics and the collective motions of ambient particles are resolved. We also observed that grain rotation can violate the conventional relation R × θ = c o n s t a n t (R is the grain radius, and θ is the misorientation angle between two grains) by emission and annihilation of dislocations across the grain, resulting in a step-by-step rotation. Besides grain growth, we discover a result in shear-induced melting: The melting volume fraction varies sinusoidally on the angle mismatch between the triangular lattice orientation of the grain and the shear direction. These discoveries hold potential to inform microstructure engineering of polycrystalline materials.more » « less
-
Not AvailableSoft-solid molecular crystals consist of crystalline grains and fluid grain boundaries (GB) that enhance the grain binding and transport of Li+ ions between the grains. The total ionic conductivity consists of ion migration in both the grains and GBs. To unravel these contributions in adiponitrile (Adpn):LiPF6 molecular crystals, the GB volume fraction was varied by changing the size of the crystals and the Adpn:LiPF6 molar ratio. Molecular dynamic (MD) simulations indicate that ion motion was sub-diffusive in the grains and “well-diffusive” in the GBs, with GBs characterized as disordered nano-confined regions of higher charge carrier concentration (~1M) than in saturated Adpn:LiPF6 solutions (0.04M), and ions predominantly solvated by -C≡N groups with few contact ion pairs. The diffusivity in the GBs is at least an order of magnitude higher than in the crystalline grains. The emergent picture is the grains as a reservoir of ions that migrate to the faster-conducting GBs.more » « less
-
Mn2B thin film deposition is explored because of the predicted promise of Mn2B as directional conductor for interconnects in integrated circuits. MnxB thin films, 40–80 nm thick, are deposited on Al2O3(0001), Al2O3(112¯0), and Al2O3(11¯02) substrates by combined d.c. and r.f. cosputtering from Mn and B targets, respectively. Energy dispersive spectroscopy analyses indicate that the Mn content decreases with increasing deposition temperature Ts = 600–800 °C, which is attributed to Mn evaporation from the substrate and growing film. Raising Ts from 600–700 °C also results in an increase in crystalline quality and surface roughness, while a further increase to Ts = 800 °C causes dewetting that results in discontinuous films. MnxB films on Al2O3(0001) and Al2O3(112¯0) form polycrystalline microstructures with random grain orientations, while Al2O3(11¯02) substrates facilitate epitaxial Mn2B(100) growth with Mn2B(100) || Al2O3(11¯02) and Mn2B[010] || Al2O3[1¯101], as determined by x-ray diffraction methods. However, the epitaxial Mn2B(100) matrix contains MnB or Mn impurity phase grains for films with B-rich or Mn-rich compositions, respectively. The room temperature resistivity ρ of polycrystalline MnxB films decreases from 153 to 70 μΩ cm with increasing x = 1.3–5.6 and is further reduced for epitaxial Mn2B(100)/Al2O3(11¯02) films with measured ρ = 44 and 107 μΩ cm for x = 2.9 and 1.7, respectively. These values are affected by electron scattering at residual impurity grains such that the Mn2B bulk resistivity along the high-conductivity [001]-direction is likely considerably smaller and may be competitive for the envisioned interconnect application.more » « less
An official website of the United States government

