A number of technological applications and scientific experiments require processes for preparing metal multilayers with electronically and thermally conductive interfaces. We investigate how in situ vs ex situ synthesis processes affect the thermal conductance of metal/metal interfaces. We use time-domain thermoreflectance experiments to study thermal transport in Au/Fe, Al/Cu, and Cu/Pt bilayer samples. We quantify the effect of exposing the bottom metal layer to an ambient environment prior to deposition of the top metal layer. We observe that for Au/Fe, exposure of the Fe layer to air before depositing the top Au layer significantly impedes interfacial electronic currents. Exposing Cu to air prior to depositing an Al layer effectively eliminates interfacial electronic heat currents between the two metal layers. Exposure to air appears to have no effect on interfacial transport in the Cu/Pt system. Finally, we show that a short RF sputter etch of the bottom layer surface is sufficient to ensure a thermally and electronically conductive metal/metal interface in all materials we study. We analyze our results with a two-temperature model and bound the electronic interface conductance for the nine samples we study. Our findings have applications for thin-film synthesis and advance fundamental understanding of electronic thermal conductance at different types of interfaces between metals.
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Ex Situ and In Situ Thermal Transformations of M-50 Pitch Revealed by Non-contact Atomic Force Microscopy
- Award ID(s):
- 2011750
- PAR ID:
- 10325130
- Date Published:
- Journal Name:
- Energy & Fuels
- Volume:
- 35
- Issue:
- 22
- ISSN:
- 0887-0624
- Page Range / eLocation ID:
- 18210 to 18219
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
-
Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1021/acs.energyfuels.1c02487
