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Title: Large-area photonic lift-off process for flexible thin-film transistors
Abstract Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the plastic substrate from a carrier without damaging the electronics remains challenging. Here we utilize a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer films from rigid carriers. PLO uses a 150 µs pulse of broadband light from flashlamps to lift-off functional thin films from glass carrier substrates coated with a light absorber layer (LAL). Modeling indicates that the polymer/LAL interface reaches above 800 °C during PLO, but the top surface of the PI remains below 120 °C. An array of indium zinc oxide (IZO) thin-film transistors (TFTs) was fabricated on a polyimide substrate and photonically lifted off from the glass carrier. The TFT mobility was unchanged by PLO. The flexible TFTs were mechanically robust, with no reduction in mobility while flexed.  more » « less
Award ID(s):
1710008 2011401
PAR ID:
10341431
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
npj Flexible Electronics
Volume:
6
Issue:
1
ISSN:
2397-4621
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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