There has been a growing interest in solution-phase routes to thermoelectric materials due to the decreased costs and novel device architectures that these methods enable. Many excellent thermoelectric materials are metal chalcogenide semiconductors and the ability to create soluble metal chalcogenide semiconductor precursors using thiol–amine solvent mixtures was recently demonstrated by others. In this paper, we report the first thermoelectric property measurements on metal chalcogenide thin films made in this manner. We create Cu 2−x Se y S 1−y and Ag-doped Cu 2−x Se y S 1−y thin films and study the interrelationship between their composition and room temperature thermoelectric properties. We find that the precursor annealing temperature affects the metal : chalcogen ratio, and leads to charge carrier concentration changes that affect the Seebeck coefficient and electrical conductivity. Increasing the Se : S ratio increases electrical conductivity and decreases the Seebeck coefficient. We also find that incorporating Ag into the Cu 2−x Se y S 1−y film leads to appreciable improvements in thermoelectric performance by increasing the Seebeck coefficient and decreasing thermal conductivity. Overall, we find that the room temperature thermoelectric properties of these solution-processed materials are comparable to measurements on Cu 2−x Se alloys made via conventional thermoelectric material processing methods. Achieving parity between solution-phase processing and conventional processing is an important milestone and demonstrates the promise of this binary solvent approach as a solution-phase route to thermoelectric materials.
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Enabling fine-grain free 2-micron thick CISe/CIGSe film fabrication via a non-hydrazine based solution processing route
Solution processing of CuInSe 2 /CuInGaSe 2 (CISe/CIGSe) photovoltaic devices via non-hydrazine based routes has been studied for the past few years and a significant improvement in the device performance has been achieved for multiple solvent routes. However, none of these routes have ever reported the fabrication of absorbers with a thickness of above 1.2–1.3 microns which is almost half of what has been traditionally used in vacuum based high efficiency CIGSe devices. The main reason for this limitation is associated with the formation of a fine-grain layer in solution based systems. Here we manipulate the formation of such a fine-grain layer in an amine–thiol based solution route through surface modifications at the bottom Mo interface and achieve an active area efficiency of up to 14.1% for CIGSe devices. Furthermore, with a detailed analysis of the fine-grain layer, not just in the amine–thiol based film, but also in the film fabricated via the dimethylformamide-thiourea route, we identify the reason for the formation of such a fine-grain layer as the presence of the sulfide material and carbon impurity (if any) in the precursor film. We utilize the amine–thiol solvent system's ability for selenium and metal selenide dissolution to manipulate the ink formulations and demonstrate the reduction in the formation of sulfide materials as well as the extent of trapped carbon in the precursor film. With modified precursor films, we then successfully grow CISe/CIGSe thin films of 2-micron thickness with the complete absence of a fine-grain layer through a high temperature, thickness independent bulk growth mechanism making the film morphology similar to the one fabricated using a high efficiency hydrazine based route.
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- Award ID(s):
- 1735282
- NSF-PAR ID:
- 10354832
- Date Published:
- Journal Name:
- Materials Advances
- Volume:
- 3
- Issue:
- 7
- ISSN:
- 2633-5409
- Page Range / eLocation ID:
- 3293 to 3302
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
-
Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1039/d2ma00095d
