An official website of the United States government
Abstract Process chemical potential control and dislocation reduction were implemented to control oxygen concentration in N-polar GaN layers grown on sapphire substrates via metal organic chemical vapor deposition (MOCVD). As process supersaturation was changed from ∼30 to 3400, the formation energy of the oxygen point defect increased, which resulted in a 25-fold decrease in oxygen incorporation. Reducing dislocations by approximately a factor of 4 (to ∼10 9 cm −3 ) allowed for further reduction of oxygen incorporation to the low-10 17 cm −3 range. Smooth N-polar GaN layers with low oxygen content were achieved by a two-step process, whereas first a 1 µ m thick smooth N-polar layer with high oxygen concentration was grown, followed by low oxygen concentration layer grown at high supersaturation.
more »
« less
Low resistivity, p-type, N-Polar GaN achieved by chemical potential control
Abstract We report on low resistivity (1.1 Ω cm) in p-type bulk doping of N-polar GaN grown by metalorganic chemical vapor deposition. High nitrogen chemical potential growth, facilitated by high process supersaturation, was instrumental in reducing the incorporation of compensating oxygen as well as nitrogen-vacancy-related point defects. This was confirmed by photoluminescence studies and temperature-dependent Hall effect measurements. The suppressed compensation led to an order of magnitude improvement in p-type conductivity with the room-temperature hole concentration and mobility measuring 6 × 10 17 cm −3 and 9 cm 2 V −1 s −1 , respectively. These results are paramount in the pathway towards N-polar GaN power and optoelectronic devices.
more »
« less
- PAR ID:
- 10359172
- Date Published:
- Journal Name:
- Applied Physics Express
- Volume:
- 15
- Issue:
- 8
- ISSN:
- 1882-0778
- Page Range / eLocation ID:
- 081004
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
The polarization difference and band offset between Al(Ga)N and GaN induce two-dimensional (2D) free carriers in Al(Ga)N/GaN heterojunctions without any chemical doping. A high-density 2D electron gas (2DEG), analogous to the recently discovered 2D hole gas in a metal-polar structure, is predicted in a N-polar pseudomorphic GaN/Al(Ga)N heterostructure on unstrained AlN. We report the observation of such 2DEGs in N-polar undoped pseudomorphic GaN/AlGaN heterostructures on single-crystal AlN substrates by molecular beam epitaxy. With a high electron density of ∼4.3 ×1013/cm2 that maintains down to cryogenic temperatures and a room temperature electron mobility of ∼450 cm2/V s, a sheet resistance as low as ∼320 Ω/◻ is achieved in a structure with an 8 nm GaN layer. These results indicate significant potential of AlN platform for future high-power RF electronics based on N-polar III-nitride high electron mobility transistors.more » « less
-
III-Nitride materials such as gallium nitride (GaN) and indium nitride (InN) are critical for applications in electronics and optoelectronics due to their exceptional properties. However, their high-temperature stability is often limited by decomposition into constituent elements at low nitrogen pressures near or below ambient. This work investigates the use of nonequilibrium nitrogen plasma to stabilize GaN and InN at elevated temperatures and low pressures. Bulk nitride synthesis was demonstrated via plasma-assisted nitridation of Ga and In metals. Following synthesis, the suppression of nitride decomposition at temperatures exceeding the predicted equilibrium limits was accomplished by means of a nonequilibrium nitrogen plasma. Experimental results revealed that the nonequilibrium plasma imparted an additional chemical potential onto the ground state nitrogen by electron impact excitation, stabilizing GaN at 1000 °C and InN at 600 °C for nitrogen partial pressures as low as 10 Pa. With this experimental approach, the chemical potential of excited nitrogen species in the plasma was estimated to be 1.8 eV higher than the ground state value. These findings highlight the potential for plasma-based processing to enable scalable synthesis and stabilization of III-nitrides at high temperatures for advanced material applications.more » « less
-
Abstract We demonstrate controlled Si doping in the low doping range of 5 × 10 15 –2.5 × 10 16 cm −3 with mobility >1000 cm 2 V −1 s −1 in GaN films grown by metalorganic chemical vapor deposition. The carbon-related compensation and mobility collapse were prevented by controlling the electrochemical potential near the growth surface via chemical potential control (CPC) and defect quasi-Fermi level (dQFL) point-defect management techniques. While the CPC was targeted to reduce the net C N concentration, the dQFL control was used to reduce the fraction of C atoms with the compensating configuration, i.e. C N − 1 . The low compensating acceptor concentration was confirmed via temperature-dependent Hall effect analysis and capacitance–voltage measurements.more » « less
-
Abstract High-quality N-polar GaN p-n diodes are realized on single-crystal N-polar GaN bulk substrate by plasma-assisted molecular beam epitaxy. The room-temperature current–voltage characteristics reveal a high on/off current ratio of >10 11 at ±4 V and an ideality factor of 1.6. As the temperature increases to 200 °C, the apparent ideality factor gradually approaches 2. At such high temperatures, Shockley–Read–Hall recombination times of 0.32–0.46 ns are estimated. The measured electroluminescence spectrum is dominated by a strong near-band edge emission, while deep level and acceptor-related luminescence is greatly suppressed.more » « less
- Free Publicly Accessible Full Text
-
Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.35848/1882-0786/ac8273
