An official website of the United States government
Abstract Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1K−1is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.
more »
« less
Thermal Conductivity Determination of Ga-In Alloys for Thermal Interface Materials Design
Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of GaxIn1−x (x = 0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100 °C, the temperatures commonly encountered in consumer electronics. The thermal conductivity of liquid and semi-liquid (liquid + β) Ga-In alloys are higher than most of the TIM’s currently used in consumer electronics. These measured quantities, along with the available experimental data from literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (calculation of phase diagrams) method for pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivities for all of the phases. Due to their ease of manufacturing and high thermal conductivity, liquid/semi-liquid Ga-In alloys have significant potential for TIM in consumer electronics.
more »
« less
- Award ID(s):
- 1808082
- PAR ID:
- 10382958
- Date Published:
- Journal Name:
- Thermo
- Volume:
- 2
- Issue:
- 1
- ISSN:
- 2673-7264
- Page Range / eLocation ID:
- 1 to 13
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
null (Ed.)Thermal conductive gap filler materials are used as thermal interface materials (TIMs) in electronic devices due their numerous advantages, such as higher thermal conductivity, ease of use, and conformity. Silicone is a class of synthetic materials based on a polymeric siloxane backbone which is widely used in thermal gap filler materials. In electronic packages, silicone-based thermal gap filler materials are widely used in industries, whereas silicone-free thermal gap filler materials are emerging as new alternatives for numerous electronics applications. Certainly, characterization of these TIMs is of immense importance since it plays a critical role in heat dissipation and long-term reliability of the electronic packages. Insubstantial studies on the effects of various chemical compounds on the properties of silicone-based and silicone-free TIMs has led to this study, which focuses on the effect of thermal aging on the mechanical, thermal, and dielectric properties of silicone-based and silicone-free TIMs and the chemical compounds that cause the changes in properties of these materials. Characterization techniques such as dynamic mechanical analysis (DMA), thermomechanical analysis (TMA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FTIR), and broadband dielectric spectroscopy (BbDS) are used to study the mechanical, thermal, and dielectric characteristics of these TIMs, which will guide towards a better understanding of the applicability and reliability of these TIMs. The experiments demonstrate that upon thermal aging at 125 °C, the silicone-free TIM becomes hard, while silicone-based TIM remains viscoelastic, which indicates its wide applicability to higher temperature applications for a long time. Though silicone-based TIM displays better mechanical and thermal properties at elevated temperatures, dielectric properties indicate low conductivity for silicone-free TIM, which makes it a better candidate for silicone-sensitive applications where higher electric insulation is desired.more » « less
-
The thermal conductivities of (100) γ-Ga2O3 films deposited on (100) MgAl2O4 substrates with various thicknesses were measured using frequency-domain thermoreflectance. The measured thermal conductivities of γ-Ga2O3 films are lower than the thermal conductivities of (2¯ 01) β-Ga2O3 films of comparable thickness, which suggests that γ-phase inclusions in the doped or alloyed β-phase may affect its thermal conductivity. The thermal conductivity of γ-Ga2O3 increases from 2.3−0.5+0.9 to 3.5±0.7 W/m K for films with thicknesses of 75–404 nm, which demonstrates a prominent size effect on thermal conductivity. The thermal conductivity of γ-Ga2O3 also shows a slight increase as temperature increases from 293 to 400 K. This increase in thermal conductivity occurs when defect and boundary scattering suppress signatures of temperature-dependent Umklapp scattering. γ-Ga2O3 has a cation-defective spinel structure with at least two gallium vacancies in every unit cell, which are the likely source of defect scattering.more » « less
-
Abstract Shape memory alloys (SMAs) absorb and release large amounts of latent heat during martensitic transformation, making them ideal candidates for applications involving thermal energy storage and management. In this study, Cu–Zn–Al SMAs were investigated as lower-cost alternatives to NiTi-based SMAs for solid–solid phase change materials. The alloys were fabricated using an unconventional method of melting and solidification of the constituent elements sealed in quartz tubes under a pressurized Ar atmosphere. The alloys synthesized were found to exhibit superior figure of merit values for thermal energy storage, as compared to conventional solid–liquid phase change materials and NiTi-based SMAs, with thermal conductivity between 59 and 75 W/mK and latent heat values ranging from 3 to 6.5 J/g. Transformation temperature ranges (Af–Mf) less than 20 °C were achieved within a wide operating temperature between − 145 °C and 100 °C. In addition, select CuZnAl compositions yielded excellent cyclic stability with only ± 2 °C shifts in transformation temperatures after 20 thermal cycles. The present study demonstrates the feasibility of CuZnAl SMAs for use in high heat flux thermal energy storage and management applications at a wider range of temperatures.more » « less
-
Thermal conductivity (TC) is greatly influenced by the working temperature, microstructures, thermal processing (heat treatment) history and the composition of alloys. Due to computational costs and lengthy experimental procedures, obtaining the thermal conductivity for novel alloys, particularly parts made with additive manufacturing, is difficult and it is almost impossible to optimize the compositional space for an absolute targeted value of thermal conductivity. To address these difficulties, a machine learning method is explored to predict the TC of additive manufactured alloys. To accomplish this, an extensive thermal conductivity dataset for additively manufactured alloys was generated for several AM alloy families (nickel, copper, iron, cobalt-based) over various temperatures (300–1273 K). This unique dataset was used in training and validating machine learning models. Among the five different regression machine learning models trained with the dataset, extreme gradient boosting performs the best as compared with other models with an R2 score of 0.99. Furthermore, the accuracy of this model was tested using Inconel 718 and GRCop-42 fabricated with laser powder bed fusion-based additive manufacture, which have never been observed by the extreme gradient boosting model, and a good match between the experimental results and machine learning prediction was observed. The average mean error in predicting the thermal conductivity of Inconel 718 and GRCop-42 at different temperatures was 3.9% and 2.08%, respectively. This paper demonstrates that the thermal conductivity of novel AM alloys could be predicted quickly based on the dataset and the ML model.more » « less
- Free Publicly Accessible Full Text
-
Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.3390/thermo2010001
