An official website of the United States government
To increase the storage capacity of hard disk drives, Heat-Assisted Magnetic Recording (HAMR) takes advantage of laser heating to temporarily reduce the coercivity of recording media, enabling the writing of very small data bits on materials with high thermal stability. One key challenge in implementing HAMR is effective thermal management, which requires reliable determination of the thermal properties of HAMR materials over their range of operating temperature. This work reports the thermal properties of dielectric (amorphous silica, amorphous alumina, and AlN), metallic (gold and copper), and magnetic alloy (NiFe and CoFe) thin films used in HAMR heads from room temperature to 500 K measured with time-domain thermoreflectance. Our results show that the thermal conductivities of amorphous silica and alumina films increase with temperature, following the typical trends for amorphous materials. The polycrystalline AlN film exhibits weak thermal anisotropy, and its in-plane and through-plane thermal conductivities decrease with temperature. The measured thermal conductivities of AlN are significantly lower than that which would be present in single-crystal bulk material, and this is attributed to enhanced phonon-boundary scattering and phonon-defect scattering. The gold, copper, NiFe, and CoFe films show little temperature dependence in their thermal conductivities over the same temperature range. The measured thermal conductivities of gold and copper films are explained by the diffuse electron-boundary scattering using an empirical model.
more »
« less
Size effects and temperature dependence in the thermal conductivity of γ-Ga2O3 films
The thermal conductivities of (100) γ-Ga2O3 films deposited on (100) MgAl2O4 substrates with various thicknesses were measured using frequency-domain thermoreflectance. The measured thermal conductivities of γ-Ga2O3 films are lower than the thermal conductivities of (2¯ 01) β-Ga2O3 films of comparable thickness, which suggests that γ-phase inclusions in the doped or alloyed β-phase may affect its thermal conductivity. The thermal conductivity of γ-Ga2O3 increases from 2.3−0.5+0.9 to 3.5±0.7 W/m K for films with thicknesses of 75–404 nm, which demonstrates a prominent size effect on thermal conductivity. The thermal conductivity of γ-Ga2O3 also shows a slight increase as temperature increases from 293 to 400 K. This increase in thermal conductivity occurs when defect and boundary scattering suppress signatures of temperature-dependent Umklapp scattering. γ-Ga2O3 has a cation-defective spinel structure with at least two gallium vacancies in every unit cell, which are the likely source of defect scattering.
more »
« less
- Award ID(s):
- 2324375
- PAR ID:
- 10629659
- Publisher / Repository:
- AIP Publishing
- Date Published:
- Journal Name:
- Applied Physics Letters
- Volume:
- 126
- Issue:
- 23
- ISSN:
- 0003-6951
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
-
Phase transitions in metastable α-, κ(ε)-, and γ-Ga2O3 films to thermodynamically stable β-Ga2O3 during annealing in air, N2, and vacuum have been systematically investigated via in situ high-temperature x-ray diffraction (HT-XRD) and scanning electron microscopy (SEM). These respective polymorphs exhibited thermal stability to ∼471–525 °C, ∼773–825 °C, and ∼490–575 °C before transforming into β-Ga2O3, across all tested ambient conditions. Particular crystallographic orientation relationships were observed before and after the phase transitions, i.e., (0001) α-Ga2O3 → (2¯01) β-Ga2O3, (001) κ(ε)-Ga2O3 → (310) and (2¯01) β-Ga2O3, and (100) γ-Ga2O3 → (100) β-Ga2O3. The phase transition of α-Ga2O3 to β-Ga2O3 resulted in catastrophic damage to the film and upheaval of the surface. The respective primary and possibly secondary causes of this damage are the +8.6% volume expansion and the dual displacive and reconstructive transformations that occur during this transition. The κ(ε)- and γ-Ga2O3 films converted to β-Ga2O3 via singular reconstructive transformations with small changes in volume and unchanged surface microstructures.more » « less
-
Thermal interface material (TIM) that exists in a liquid state at the service temperature enables efficient heat transfer across two adjacent surfaces in electronic applications. In this work, the thermal conductivities of different phase regions in the Ga-In system at various compositions and temperatures are measured for the first time. A modified comparative cut bar technique is used for the measurement of the thermal conductivities of GaxIn1−x (x = 0, 0.1, 0.214, 0.3, and 0.9) alloys at 40, 60, 80, and 100 °C, the temperatures commonly encountered in consumer electronics. The thermal conductivity of liquid and semi-liquid (liquid + β) Ga-In alloys are higher than most of the TIM’s currently used in consumer electronics. These measured quantities, along with the available experimental data from literature, served as input for the thermal conductivity parameter optimization using the CALPHAD (calculation of phase diagrams) method for pure elements, solution phase, and two-phase region. A set of self-consistent parameters for the description of the thermal conductivity of the Ga-In system is obtained. There is good agreement between the measured and calculated thermal conductivities for all of the phases. Due to their ease of manufacturing and high thermal conductivity, liquid/semi-liquid Ga-In alloys have significant potential for TIM in consumer electronics.more » « less
-
In this Letter, the role of background carbon in metalorganic chemical vapor deposition (MOCVD) β-Ga2O3 growth using trimethylgallium (TMGa) as the Ga precursor was investigated. The quantitative C and H incorporations in MOCVD β-Ga2O3 thin films grown at different growth rates and temperatures were measured via quantitative secondary ion mass spectroscopy (SIMS). The SIMS results revealed both [C] and [H] increase as the TMGa molar flow rate/growth rate increases or growth temperature decreases. The intentional Si incorporation in MOCVD β-Ga2O3 thin films decreases as the growth rate increases or the growth temperature decreases. For films grown at relatively fast growth rates (GRs) (TMGa > 58 μmol/min, GR > 2.8 μm/h) or relatively low temperature (<950 °C), the [C] increases faster than that of the [H]. The experimental results from this study demonstrate the previously predicted theory—H can effectively passivate the compensation effect of C in n-type β-Ga2O3. The extracted net doping concentration from quantitative SIMS {[Si]-([C]-[H])} agrees well with the free carrier concentration measured from Hall measurement. The revealing of the role of C compensation in MOCVD β-Ga2O3 and the effect of H incorporation will provide guidance on designing material synthesis for targeted device applications.more » « less
-
Perovskite materials, of which strontium titanate (STO) and its thin films are an example, have attracted significant scientific interest because of their desirable properties and the potential to tune thermal conductivity by employing several techniques. Notably, strontium titanate thin films on silicon (Si) substrates serve as a fundamental platform for integrating various oxides onto Si substrates, making it crucial to understand the thermal properties of STO on Si. This work investigates the thermal conductivity of STO thin films on an Si substrate for varying film thicknesses (12, 50, 80, and 200 nm) at room temperature (∼300 K). The thin films are deposited using molecular beam epitaxy on the Si substrate and their thermal conductivity is characterized using the frequency domain thermoreflectance (FDTR) method. The measured values range from 7.4 ± 0.74 for the 200 nm thick film to 0.8 ± 0.1 W m−1 K−1 for the 12 nm thick film, showing a large effect of the film thickness on the thermal conductivity values. The trend of the values is diminishing with the corresponding decrease in the thin film thickness, with a reduction of 38%–93% in the thermal conductivity values, for film thicknesses ranging from 200 to 12 nm. This reduction in the values is relative to the bulk single crystal values of STO, which may range from 11 to 13.5 W m−1 K−1 [Yu et al., Appl. Phys. Lett. 92, 191911 (2008) and Fumega et al., Phys. Rev. Mater. 4, 033606 (2020)], as measured by our FDTR-based experiment. The study also explores the evaluation of volumetric heat capacity (Cp). The measured volumetric heat capacity for the 200 nm thin film is 3.07 MJ m−3 K−1, which is in reasonable agreement with the values available in the literature.more » « less
- Free Publicly Accessible Full Text
-
Accepted Manuscript
- Journal Article:
- https://doi.org/10.1063/5.0270256
