The effect of doping in the drift layer and the thickness and extent of extension beyond the cathode contact of a NiO bilayer in vertical NiO/β-Ga2O3 rectifiers is reported. Decreasing the drift layer doping from 8 × 1015 to 6.7 × 1015 cm−3 produced an increase in reverse breakdown voltage (VB) from 7.7 to 8.9 kV, the highest reported to date for small diameter devices (100 μm). Increasing the bottom NiO layer from 10 to 20 nm did not affect the forward current–voltage characteristics but did reduce reverse leakage current for wider guard rings and reduced the reverse recovery switching time. The NiO extension beyond the cathode metal to form guard rings had only a slight effect (∼5%) in reverse breakdown voltage. The use of NiO to form a pn heterojunction made a huge improvement in VB compared to conventional Schottky rectifiers, where the breakdown voltage was ∼1 kV. The on-state resistance (RON) was increased from 7.1 m Ω cm2 in Schottky rectifiers fabricated on the same wafer to 7.9 m Ω cm2 in heterojunctions. The maximum power figure of merit (VB)2/RON was 10.2 GW cm−2 for the 100 μm NiO/Ga2O3 devices. We also fabricated large area (1 mm2) devices on the same wafer, achieving VB of 4 kV and 4.1 A forward current. The figure-of-merit was 9 GW cm−2 for these devices. These parameters are the highest reported for large area Ga2O3 rectifiers. Both the small area and large area devices have performance exceeding the unipolar power device performance of both SiC and GaN.
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This content will become publicly available on June 15, 2024
Superior high temperature performance of 8 kV NiO/Ga 2 O 3 vertical heterojunction rectifiers
NiO/β-Ga 2 O 3 vertical rectifiers exhibit near-temperature-independent breakdown voltages ( V B ) of >8 kV to 600 K. For 100 μm diameter devices, the power figure of merit ( V B ) 2 / R ON , where R ON is the on-state resistance, was 9.1 GW cm −2 at 300 K and 3.9 GW cm −2 at 600 K. By sharp contrast, Schottky rectifiers fabricated on the same wafers show V B of ∼1100 V at 300 K, with a negative temperature coefficient of breakdown of 2 V K −1 . The corresponding figures of merit for Schottky rectifiers were 0.22 GW cm −2 at 300 K and 0.59 MW cm −2 at 600 K. The on–off ratio remained >10 10 up to 600 K for heterojunction rectifiers but was 3 orders of magnitude lower over the entire temperature range for Schottky rectifiers. The power figure of merit is higher by a factor of approximately 6 than the 1-D unipolar limit of SiC. The reverse recovery times were ∼26 ± 2 ns for both types of devices and were independent of temperature. We also fabricated large area, 1 mm 2 rectifiers. These exhibited V B of 4 kV at 300 K and 3.6 kV at 600 K. The results show the promise of using this transparent oxide heterojunction for high temperature, high voltage applications.
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- Award ID(s):
- 1856662
- NSF-PAR ID:
- 10422837
- Date Published:
- Journal Name:
- Journal of Materials Chemistry C
- Volume:
- 11
- Issue:
- 23
- ISSN:
- 2050-7526
- Page Range / eLocation ID:
- 7750 to 7757
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Vertical heterojunction NiO/β n-Ga 2 O/n + Ga 2 O 3 rectifiers employing NiO layer extension beyond the rectifying contact for edge termination exhibit breakdown voltages (V B ) up to 4.7 kV with a power figure-of-merits, V B 2 /R ON of 2 GW·cm −2 , where R ON is the on-state resistance (11.3 mΩ cm 2 ). Conventional rectifiers fabricated on the same wafers without NiO showed V B values of 840 V and a power figure-of-merit of 0.11 GW cm −2 . Optimization of the design of the two-layer NiO doping and thickness and also the extension beyond the rectifying contact by TCAD showed that the peak electric field at the edge of the rectifying contact could be significantly reduced. The leakage current density before breakdown was 144 mA/cm 2 , the forward current density was 0.8 kA/cm 2 at 12 V, and the turn-on voltage was in the range of 2.2–2.4 V compared to 0.8 V without NiO. Transmission electron microscopy showed sharp interfaces between NiO and epitaxial Ga 2 O 3 and a small amount of disorder from the sputtering process.more » « less
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Vertical geometry NiO/β n-Ga2O/n+ Ga2O3 heterojunction rectifiers with contact sizes from 50 to 200 μm diameter showed breakdown voltages (VB) up to 7.5 kV for drift region carrier concentration of 8 × 1015 cm−3. This exceeds the unipolar 1D limit for SiC and was achieved without substrate thinning or annealing of the epi layer structure. The power figure-of-merit, VB2/RON, was 6.2 GW cm−2, where RON is the on-state resistance (9.3–14.7 mΩ cm2). The average electric field strength was 7.56 MV/cm, approaching the maximum for β-Ga2O3. The on–off ratio switching from 5 to 0 V was 2 × 1013, while it was 3 × 1010–2 × 1011 switching to 100 V. The turn-on voltage was in the range 1.9–2.1 V for the different contact diameters, while the reverse current density was in the range 2 × 10−8–2 × 10−9 A cm−2 at −100 V. The reverse recovery time was 21 ns, while the forward current density was >100 A/cm2 at 5 V.more » « less
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