Chae, Hyunsu, Mutnury, Bhyrav, Zhu, Keren, Wallace, Douglas, Winterberg, Douglas, De Araujo, Daniel, Reddy, Jay, Klivans, Adam, and Pan, David Z. ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design. Retrieved from https://par.nsf.gov/biblio/10423020. 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) . Web. doi:10.23919/DATE56975.2023.10137055.

Chae, Hyunsu, Mutnury, Bhyrav, Zhu, Keren, Wallace, Douglas, Winterberg, Douglas, De Araujo, Daniel, Reddy, Jay, Klivans, Adam, & Pan, David Z. ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design. 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), (). Retrieved from https://par.nsf.gov/biblio/10423020. https://doi.org/10.23919/DATE56975.2023.10137055

Chae, Hyunsu, Mutnury, Bhyrav, Zhu, Keren, Wallace, Douglas, Winterberg, Douglas, De Araujo, Daniel, Reddy, Jay, Klivans, Adam, and Pan, David Z. "ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design". 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) (). Country unknown/Code not available. https://doi.org/10.23919/DATE56975.2023.10137055. https://par.nsf.gov/biblio/10423020.

@article{osti_10423020,
place = {Country unknown/Code not available}, title = {ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design}, url = {https://par.nsf.gov/biblio/10423020}, DOI = {10.23919/DATE56975.2023.10137055}, abstractNote = {}, journal = {2023 Design, Automation & Test in Europe Conference & Exhibition (DATE)}, author = {Chae, Hyunsu and Mutnury, Bhyrav and Zhu, Keren and Wallace, Douglas and Winterberg, Douglas and De Araujo, Daniel and Reddy, Jay and Klivans, Adam and Pan, David Z.}, }