A simple room‐temperature process of depositing MXene on a III‐V structure with embedded 2D electron gas (2DEG) is used, which results in a large area, , photodetector (PD) device that greatly outperforms vacuum deposited Ti/Au metal‐semiconductor‐metal (MSM) PD's. By co‐optimizing properties of 2D MXene contacts and the III‐V material heterojunctions, this device sets new operating records with responsivity up to 1.04 A W‐1at low optical powers, corresponding to >230% internal quantum efficiency, dark current of 50 , >105.6‐dB dynamic range, and 25–150 ps response time, which improves the previous MXene‐Semiconductor‐MXene responsivity by >2.7 times and is 7 × 103–−106times faster compared to other MXene‐based PDs. This is achieved by enhancing the Schottky barrier height by forming a Van der Waals (vdW) heterojunction between a wide bandgap AlGaAs surface layer and spin coated
2D semiconductors such as monolayer molybdenum disulfide (MoS2) are promising material candidates for next‐generation nanoelectronics. However, there are fundamental challenges related to their metal–semiconductor (MS) contacts, which limit the performance potential for practical device applications. In this work, 2D monolayer hexagonal boron nitride (
- Award ID(s):
- 1944095
- PAR ID:
- 10456806
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials
- Volume:
- 32
- Issue:
- 36
- ISSN:
- 0935-9648
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
More Like this
-
Abstract Ti 3C 2T z electrodes. A layered architecture transports the optically generated electrons to a 2DEG channel at the GaAs/AlGaAs heterointerface, where they are rapidly collected. The landscaped electric field pushes the slow holes to an underlying low temperature‐grown GaAs (LT‐GaAs) region where they recombine. The proposed Schottky‐2DEG Photoconductor‐Schottky model for device operation shows how this device circumvents the canonical limitations of gain‐bandwidth product, and carrier transit time, while replacing the need for vacuum deposition of gold or other precious metals. -
null (Ed.)High contact resistance is one of the primary concerns for electronic device applications of two-dimensional (2D) layered semiconductors. Here, we explore the enhanced carrier transport through metal–semiconductor interfaces in WS 2 field effect transistors (FETs) by introducing a typical transition metal, Cu, with two different doping strategies: (i) a “generalized” Cu doping by using randomly distributed Cu atoms along the channel and (ii) a “localized” Cu doping by adapting an ultrathin Cu layer at the metal–semiconductor interface. Compared to the pristine WS 2 FETs, both the generalized Cu atomic dopant and localized Cu contact decoration can provide a Schottky-to-Ohmic contact transition owing to the reduced contact resistances by 1–3 orders of magnitude, and consequently elevate electron mobilities by 5–7 times. Our work demonstrates that the introduction of transition metal can be an efficient and reliable technique to enhance the carrier transport and device performance in 2D TMD FETs.more » « less
-
Internal photoemission or hot-electron injection (HEJ) occurring at the metal-semiconductor (MS) Schottky interface has shown great promise in sub-bandgap photodetection and photovoltaics. In this paper, we put forward a plasmonic metagrating-interlayer-semiconductor (PMIS) structure that can significantly enhance the photon-to-electron conversion efficiency of HEJ-based optoelectronic devices. Thanks to the effect of image force-induced barrier lowering, a metal-interlayer-semiconductor (MIS) heterojunction with an ultrathin 2D material interlayer can considerably facilitate the hot electron transport across the Schottky barrier, resulting in a high internal quantum efficiency (IQE). Meanwhile, nanopatterning the MIS heterojunction into the plasmonic metagrating enables high optical absorption such that the device’s external quantum efficiency (EQE) can be nearly equal to its IQE. In addition, this device can be wavelength- and polarization-selective by tailoring the geometry and dimensions of plasmonic metagrating, thereby paving a promising path toward bandgap-independent photodetection, energy harvesting, and photocatalysis.
-
Abstract The performance of electronic/optoelectronic devices is governed by carrier injection through metal–semiconductor contact; therefore, it is crucial to employ low‐resistance source/drain contacts. However, unintentional introduction of extrinsic defects, such as substoichiometric oxidation states at the metal–semiconductor interface, can degrade carrier injection. In this report, controlling the unintentional extrinsic defect states in layered MoS2is demonstrated using a two‐step chemical treatment, (NH4)2S(aq) treatment and vacuum annealing, to enhance the contact behavior of metal/MoS2interfaces. The two‐step treatment induces changes in the contact of single layer MoS2field effect transistors from nonlinear Schottky to Ohmic behavior, along with a reduction of contact resistance from 35.2 to 5.2 kΩ. Moreover, the enhancement of
I ONand electron field effect mobility of single layer MoS2field effect transistors is nearly double forn‐ branch operation. This enhanced contact behavior resulting from the two‐step treatment is likely due to the removal of oxidation defects, which can be unintentionally introduced during synthesis or fabrication processes. The removal of oxygen defects is confirmed by scanning tunneling microscopy and X‐ray photoelectron spectroscopy. This two‐step (NH4)2S(aq) chemical functionalization process provides a facile pathway to controlling the defect states in transition metal dichalcogenides (TMDs), to enhance the metal‐contact behavior of TMDs. -
Abstract This paper provides comprehensive experimental analysis relating to improvements in the two-dimensional (2D) p-type metal–oxide–semiconductor (PMOS) field effect transistors (FETs) by pure van der Waals (vdW) contacts on few-layer tungsten diselenide (WSe2) with high-k metal gate (HKMG) stacks. Our analysis shows that standard metallization techniques (e.g., e-beam evaporation at moderate pressure ~ 10–5 torr) results in significant Fermi-level pinning, but Schottky barrier heights (SBH) remain small (< 100 meV) when using high work function metals (e.g., Pt or Pd). Temperature-dependent analysis uncovers a more dominant contribution to contact resistance from the channel access region and confirms significant improvement through less damaging metallization techniques (i.e., reduced scattering) combined with strongly scaled HKMG stacks (enhanced carrier density). A clean contact/channel interface is achieved through high-vacuum evaporation and temperature-controlled stepped deposition providing large improvements in contact resistance. Our study reports low contact resistance of 5.7 kΩ-µm, with on-state currents of ~ 97 µA/µm and subthreshold swing of ~ 140 mV/dec in FETs with channel lengths of 400 nm. Furthermore, theoretical analysis using a Landauer transport ballistic model for WSe2SB-FETs elucidates the prospects of nanoscale 2D PMOS FETs indicating high-performance (excellent on-state current vs subthreshold swing benchmarks) towards the ultimate CMOS scaling limit.