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1. Ferroelectric transistor model based on self-consistent solution of 2D Poisson's, non-equilibrium Green's function and multi-domain Landau Khalatnikov equations

   https://doi.org/10.1109/IEDM.2017.8268385  

   Saha, A. K. ; Sharma, P. ; Dabo, I. ; Datta, S. ; Gupta, S. K. ( December 2017 , International Electron Device Meetings)

   We present a physics-based model for ferroelectric/negative capacitance transistors (FEFETs/ NCFETs) without an inter-layer metal between ferroelectric and dielectric in the gate stack. The model self-consistently solves 2D Poisson's equation, non-equilibrium Green's function (NEGF) based charge and transport equations, and multi-domain Landau Khalatnikov (LK) equations with the domain interaction term. The proposed simulation framework captures the variation of ferroelectric (FE) polarization (P) along the gate length due to non-uniform electric field (E) along the channel. To calibrate the LK equations, we fabricate and characterize 10nm HZO films. Based on the calibrated model, we analyze the gate/drain voltage dependence of P distribution in the FE and its effect on the channel potential and current-voltage characteristics. Our results highlight the importance of larger domain interaction to boost the benefits of FEFETs with subthreshold swing (SS) as small as ~50mV/decade achieved at room temperature. As domain interaction increases, the characteristics of FEFETs without inter-layer metal (SS, negative drain induced barrier lowering (DIBL), negative output conductance) approach those of FEFETs with inter-layer metal. 

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2. Field‐Induced Ferroelectric Phase Evolution During Polarization “Wake‐Up” in Hf 0.5 Zr 0.5 O 2 Thin Film Capacitors

   https://doi.org/10.1002/aelm.202300016  

   Saini, Balreen ; Huang, Fei ; Choi, Yoon‐Young ; Yu, Zhouchangwan ; Thampy, Vivek ; Baniecki, John D. ; Tsai, Wilman ; McIntyre, Paul C. ( April 2023 , Advanced Electronic Materials)

   As an emerging nonvolatile memory technology, HfO₂‐based ferroelectrics exhibit excellent compatibility with silicon CMOS process flows; however, the reliability of polarization switching in these materials remains a major challenge. During repeated field programming and erase of the polarization state of initially pristine HfO₂‐based ferroelectric capacitors, the magnitude of the measured polarization increases, a phenomenon known as “wake‐up”. In this study, the authors attempt to understand what causes the wake‐up effect in Hf_0.5Zr_0.5O₂(HZO) capacitors using nondestructive methods that probe statistically significant sample volumes. Synchrotron X‐ray diffraction reveals a concerted shift in HZO Bragg peak position as a function of polarization switching cycle number in films prepared under conditions such that they exhibit extremely large (≈3000%) wake‐up. In contrast, a control sample with insignificant wake‐up shows no such peak shift. Capacitance – voltage measurements show evolution in the capacitance loop with switching cycle number for the wake‐up sample and no change for the control sample. Piezoresponse force microscopy measurements are utilized to visualize the domain switching with wake‐up. The combination of these observations clearly demonstrates that wake‐up is caused by a field‐driven phase transformation of the tetragonal phase to the metastable ferroelectric orthorhombic phase during polarization switching of HZO capacitors.

    

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3. Ferroelectric Tunneling Junctions Based on Aluminum Oxide/ Zirconium-Doped Hafnium Oxide for Neuromorphic Computing

   https://doi.org/10.1038/s41598-019-56816-x  

   Ryu, Hojoon ; Wu, Haonan ; Rao, Fubo ; Zhu, Wenjuan ( December 2019 , Scientific Reports)

   Ferroelectric tunneling junctions (FTJs) with tunable tunneling electroresistance (TER) are promising for many emerging applications, including non-volatile memories and neurosynaptic computing. One of the key challenges in FTJs is the balance between the polarization value and the tunneling current. In order to achieve a sizable on-current, the thickness of the ferroelectric layer needs to be scaled down below 5 nm. However, the polarization in these ultra-thin ferroelectric layers is very small, which leads to a low tunneling electroresistance (TER) ratio. In this paper, we propose and demonstrate a new type of FTJ based on metal/Al₂O₃/Zr-doped HfO₂/Si structure. The interfacial Al₂O₃layer and silicon substrate enable sizable TERs even when the thickness of Zr-doped HfO₂(HZO) is above 10 nm. We found that F-N tunneling dominates at read voltages and that the polarization switching in HZO can alter the effective tunneling barrier height and tune the tunneling resistance. The FTJ synapses based on Al₂O₃/HZO stacks show symmetric potentiation/depression characteristics and widely tunable conductance. We also show that spike-timing-dependent plasticity (STDP) can be harnessed from HZO based FTJs. These novel FTJs will have high potential in non-volatile memories and neural network applications.

    

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4. Transparent InGaZnO-Based Resistive Random Access Memory

   Qin, Fei ; Lee, Sunghwan ( May 2022 , Materials Research Society)

   The major focus of artificial intelligence (AI) research is made on biomimetic synaptic processes that are mimicked by functional memory devices in the computer industry [1]. It is urgent to find a memory technology for suiting with Brain-Inspired Computing to break the von Neumann bottleneck which limits the efficiency of conventional computer architectures [2]. Silicon-based flash memory, which currently dominates the market for data storage devices, is facing challenging issues to meet the needs of future data storage device development due to the limitations, such as high-power consumption, high operation voltage, and low retention capacity [1]. The emerging resistive random-access memory (RRAM) has elicited intense research as its simple sandwiched structure, including top electrode (TE) layer, bottom electrode (BE) layer, and an intermediate resistive switching (RS) layer, can store data using RS phenomenon between the high resistance state (HRS) and the low resistance state (LRS). This class of emerging devices is expected to outperform conventional memory devices [3]. Specifically, the advantages of RRAM include low-voltage operation, short programming time, great cyclic stability, and good scalability [4]. Among the materials for RS layer, indium gallium zinc oxide (IGZO) has attracted attention because of its abundance and high atomic diffusion property of oxygen atoms, transparency, and its easily modulated electrical properties by controlling the stoichiometric ratio of indium and gallium as well as oxygen potential in the sputter gas [5, 6]. Moreover, since the IGZO can be applied to both the thin-film transistor (TFT) channel and RS layer, the IGZO-based fully integrated transparent electronics are very promising [5]. In this work, we proposed transparent IGZO-based RRAMs. First, we chose ITO to serve as both TE and BE to achieve high transmittance in the visible regime of light. All three layers (TE, RS, BE layers) were deposited using a multi-target magnetron sputtering system on glass substrates to demonstrate fully transparent oxide-based devices. I-V characteristics were evaluated by a semiconductor parameter analyzer, and our devices showed typical butterfly curves indicating the bipolar RS property. And the IGZO-based RRAM can survive more than 50 continuous sweeping cycles. The optical transmission analysis was carried out via an UV-Vis spectrometer and the average transmittance around 80% out of entire devices in the visible-light wavelength range, implying high transparency. To investigate the thickness dependence on the properties of RS layer, 50nm, 100nm and 150nm RS layer of IGZO RRAM were fabricated. Also, the oxygen partial pressure during the sputtering of IGZO was varied to optimize the property because the oxygen vacancy concentration governs the RS and RRAM performance. Electrode selection is crucial and can impact the performance of the whole device [7]. Thus, Cu TE was chosen for our second type of device because the diffusion of Cu ions can be beneficial for the formation the conductive filament (CF). Finally, a ~5 nm SiO2 barrier layer was employed between TE and RS layers to confine the diffusion of Cu into the RS layer. At the same time, this SiO2 inserting layer can provide an additional interfacial series resistance in the device to lower the off current, consequently, improve the on/off ratio and whole performance. In conclusion, the transparent IGZO-based RRAMs were established. To tune the property of RS layer, the thickness layer and sputtering conditions of RS were adjusted. In order to engineer the diffusion capability of the TE material to the RS layer and the BE, a set of TE materials and a barrier layer were integrated in IGZO-based RRAM and the performance was compared. Our encouraging results clearly demonstrate that IGZO is a promising material in RRAM applications and overcoming the bottleneck of current memory technologies. 

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5. Wake-up free ferroelectric hafnia-zirconia capacitors fabricated via vacuum-maintaining atomic layer deposition

   https://doi.org/10.1063/5.0147124  

   Hsain, H. Alex ; Lee, Younghwan ; Lomenzo, Patrick D. ; Alcala, Ruben ; Xu, Bohan ; Mikolajick, Thomas ; Schroeder, Uwe ; Parsons, Gregory N. ; Jones, Jacob L. ( June 2023 , Journal of Applied Physics)

   Ferroelectric hafnium-zirconium oxide (HZO) is an excellent candidate for low-power non-volatile memory applications due to its demonstrated ferroelectricity at the nanoscale and compatibility with silicon-based technologies. The interface of HZO in contact with its electrode, typically TiN in a metal–ferroelectric–metal (MFM) capacitor configuration, is of particular interest because factors, such as volume confinement, impurity concentration, interfacial layers, thermal expansion mismatch, and defect trapping, are believed to play a crucial role in the ferroelectric performance of HZO-based devices. Processing variables, such as precursor type, oxygen source, dose duration, and deposition temperature, are known to strongly affect the quality of the oxide–metal interface. However, not many studies have focused on the effect of breaking or maintaining vacuum during MFM deposition. In this study, sequential, no-atmosphere processing (SNAP) is employed to avoid atmospheric exposure, where electrode TiN and ferroelectric HZO are deposited sequentially in the atomic layer deposition chamber without breaking vacuum. The effect of breaking vacuum during the sequential deposition steps is elucidated by fabricating and characterizing MFM capacitors with and without intentional vacuum breaks prior to the deposition of the HZO and top TiN. Using x-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectrometry (ToF-SIMS), we reveal that breaking vacuum after bottom TiN electrode deposition leads to interfacial oxidation and increased carbon contamination, which preferentially stabilizes the non-ferroelectric tetragonal phase and lead to diminished remanent polarization. Avoiding carbon impurities and interfacial TiOx at the HZO and TiN interface using SNAP leads to heightened remanent polarization, reduced leakage current density, and elimination of the wake-up effect. Our work highlights the effect of vacuum breaking on the processing-structure-properties of HZO-based capacitors, revealing that maintaining vacuum can significantly improve ferroelectric properties.

    

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