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1. EuO epitaxy by oxygen scavenging on SrTiO3 (001): Effect of SrTiO3 thickness and temperature

   https://doi.org/10.1063/1.5059560  

   Guo, Wei; Posadas, Agham B.; Lu, Sirong; Smith, David J.; Demkov, Alexander A. (December 2018, Journal of Applied Physics)

   The EuO/SrTiO3 heterojunction is a promising combination of a ferromagnetic material and a two-dimensional electron system. We explore the deposition of Eu metal on SrTiO3/Si pseudo-substrates, with varying SrTiO3 (STO) thickness, under ultrahigh vacuum conditions. By varying the thickness of the STO layer (2-10 nm) and the deposition temperature (20-300 °C), we investigate the process by which oxygen is scavenged from STO by Eu. In situ x-ray photoelectron spectroscopy is used to investigate the electronic structure of the nominal Eu/STO/Si stack. We find that as a result of Eu deposition, epitaxial EuO is formed on thick STO (6-10 nm), leaving behind a highly oxygen-deficient SrTiO3-δ layer of ∼4 nm in thickness. However, if the thickness of the STO layer is comparable to or less than the scavenging depth, the crystal structure of STO is disrupted and a solid state reaction between Eu, Si, and STO occurs when the deposition is done at a high temperature (300 °C). On the other hand, at a low temperature (20 °C), only a 1-2 nm-thick EuO interlayer is grown, on top of which the Eu metal appears to be stable. This study elucidates the growth process under different conditions and provides a better understanding and control of this system. 

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2. Thickness and temperature dependence of the atomic-scale structure of SrRuO3 thin films

   https://doi.org/10.1063/5.0087791  

   Zhang, Xuanyi; Penn, Aubrey_N; Wysocki, Lena; Zhang, Zhan; van_Loosdrecht, Paul_H_M; Kornblum, Lior; LeBeau, James_M; Lindfors-Vrejoiu, Ionela; Kumah, Divine_P (May 2022, APL Materials)

   The temperature-dependent layer-resolved structure of 3 to 44 unit cell thick SrRuO3 (SRO) films grown on Nb-doped SrTiO3 substrates is investigated using a combination of high-resolution synchrotron x-ray diffraction and high-resolution electron microscopy to understand the role that structural distortions play in suppressing ferromagnetism in ultra-thin SRO films. The oxygen octahedral tilts and rotations and Sr displacements characteristic of the bulk orthorhombic phase are found to be strongly dependent on temperature, the film thickness, and the distance away from the film–substrate interface. For thicknesses, t, above the critical thickness for ferromagnetism (t > 3 uc), the orthorhombic distortions decrease with increasing temperature above TC. Below TC, the structure of the films remains constant due to the magneto-structural coupling observed in bulk SRO. The orthorhombic distortions are found to be suppressed in the 2–3 interfacial layers due to structural coupling with the SrTiO3 substrate and correlate with the critical thickness for ferromagnetism in uncapped SRO films. 

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3. CuTi as Potential Liner- and Barrier-Free Interconnect Conductor

   https://doi.org/10.1109/TED.2024.3373376  

   Zhang, Minghua; Gall, Daniel (May 2024, IEEE Transactions on Electron Devices)

   CuTi layers are co-sputter deposited on 20-nm-SiO2/Si(001) wafers at 350 ℃ to quantify their stability in direct contact with a dielectric and to explore the potential of CuTi as barrier- and liner-free interconnect metal. X-ray diffraction pole figures indicate a preferred 001 out-of-plane crystalline orientation and Rutherford backscattering confirms a stoichiometric composition. Vacuum annealing tests at 450 ℃ of CuTi layers indicate considerably higher thermal stability than for pure Cu layers, including negligible dewetting observed by scanning electron microscopy and negligible intermixing with the oxide substrate quantified by photoelectron spectroscopy. Four-point bend tests show a 25% higher interfacial toughness for CuTi/SiO2 than Cu/SiO2 interfaces. CuTi/SiO2 samples also exhibit a 300-times longer failure time than Cu/SiO2 during time-dependent dielectric breakdown tests using an externally applied 3 MV/cm electric field. The higher stability of CuTi in comparison to Cu is attributed to a higher cohesive energy in combination with an atomically thin self-limiting Ti oxide layer at the CuTi/SiO2 interface. 

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4. Influence of misfit dislocations on ionic conductivity at oxide interfaces

   https://doi.org/10.1039/D4TA02034K  

   Ebmeyer, William; Hatton, Peter; Uberuaga, Blas P; Dholabhai, Pratik P (August 2024, Journal of Materials Chemistry A)

   Mismatched complex oxide thin films and heterostructures have gained significant traction for use as electrolytes in intermediate temperature solid oxide fuel cells, wherein interfaces exhibit variation in ionic conductivity as compared to the bulk. Although misfit dislocations present at interfaces in these structures impact ionic conductivity, the fundamental mechanisms responsible for this effect are not well understood. To this end, a kinetic lattice Monte Carlo (KLMC) model was developed to trace oxygen vacancy diffusion at misfit dislocations in SrTiO3/BaZrO3 heterostructures and elucidate the atomistic mechanisms governing ionic diffusion at oxide interfaces. The KLMC model utilized oxygen vacancy migration energy barriers computed using molecular statics. While some interfaces promote oxygen vacancy diffusion, others impede their transport. Fundamental factors such as interface layer chemistry, misfit dislocation structure, and starting and ending sites of migrating ions play a crucial role in oxygen diffusivity. Molecular dynamics (MD) simulations were further performed to support qualitative trends for oxygen vacancy diffusion. Overall, the agreement between KLMC and MD is quite good, though MD tends to predict slightly higher conductivities, perhaps a reflection of nuanced structural relaxations that are not captured by KLMC. The current framework comprising KLMC modeling integrated with molecular statics offers a powerful tool to perform mechanistic studies focused on ionic transport in thin film oxide electrolytes and facilitate their rational design. 

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5. Transparent InGaZnO-Based Resistive Random Access Memory

   Qin, Fei; Lee, Sunghwan (May 2022, Materials Research Society)

   The major focus of artificial intelligence (AI) research is made on biomimetic synaptic processes that are mimicked by functional memory devices in the computer industry [1]. It is urgent to find a memory technology for suiting with Brain-Inspired Computing to break the von Neumann bottleneck which limits the efficiency of conventional computer architectures [2]. Silicon-based flash memory, which currently dominates the market for data storage devices, is facing challenging issues to meet the needs of future data storage device development due to the limitations, such as high-power consumption, high operation voltage, and low retention capacity [1]. The emerging resistive random-access memory (RRAM) has elicited intense research as its simple sandwiched structure, including top electrode (TE) layer, bottom electrode (BE) layer, and an intermediate resistive switching (RS) layer, can store data using RS phenomenon between the high resistance state (HRS) and the low resistance state (LRS). This class of emerging devices is expected to outperform conventional memory devices [3]. Specifically, the advantages of RRAM include low-voltage operation, short programming time, great cyclic stability, and good scalability [4]. Among the materials for RS layer, indium gallium zinc oxide (IGZO) has attracted attention because of its abundance and high atomic diffusion property of oxygen atoms, transparency, and its easily modulated electrical properties by controlling the stoichiometric ratio of indium and gallium as well as oxygen potential in the sputter gas [5, 6]. Moreover, since the IGZO can be applied to both the thin-film transistor (TFT) channel and RS layer, the IGZO-based fully integrated transparent electronics are very promising [5]. In this work, we proposed transparent IGZO-based RRAMs. First, we chose ITO to serve as both TE and BE to achieve high transmittance in the visible regime of light. All three layers (TE, RS, BE layers) were deposited using a multi-target magnetron sputtering system on glass substrates to demonstrate fully transparent oxide-based devices. I-V characteristics were evaluated by a semiconductor parameter analyzer, and our devices showed typical butterfly curves indicating the bipolar RS property. And the IGZO-based RRAM can survive more than 50 continuous sweeping cycles. The optical transmission analysis was carried out via an UV-Vis spectrometer and the average transmittance around 80% out of entire devices in the visible-light wavelength range, implying high transparency. To investigate the thickness dependence on the properties of RS layer, 50nm, 100nm and 150nm RS layer of IGZO RRAM were fabricated. Also, the oxygen partial pressure during the sputtering of IGZO was varied to optimize the property because the oxygen vacancy concentration governs the RS and RRAM performance. Electrode selection is crucial and can impact the performance of the whole device [7]. Thus, Cu TE was chosen for our second type of device because the diffusion of Cu ions can be beneficial for the formation the conductive filament (CF). Finally, a ~5 nm SiO2 barrier layer was employed between TE and RS layers to confine the diffusion of Cu into the RS layer. At the same time, this SiO2 inserting layer can provide an additional interfacial series resistance in the device to lower the off current, consequently, improve the on/off ratio and whole performance. In conclusion, the transparent IGZO-based RRAMs were established. To tune the property of RS layer, the thickness layer and sputtering conditions of RS were adjusted. In order to engineer the diffusion capability of the TE material to the RS layer and the BE, a set of TE materials and a barrier layer were integrated in IGZO-based RRAM and the performance was compared. Our encouraging results clearly demonstrate that IGZO is a promising material in RRAM applications and overcoming the bottleneck of current memory technologies. 

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