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Title: Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication
Award ID(s):
2211617
NSF-PAR ID:
10475050
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
IEEE
Date Published:
ISBN:
978-1-6654-8494-7
Page Range / eLocation ID:
546 to 549
Format(s):
Medium: X
Location:
Milan, Italy
Sponsoring Org:
National Science Foundation
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