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Gallium nitride (GaN) high electron mobility transistors (HEMTs) are key components enabling today’s wireless communication systems. However, overheating concerns hinder today’s commercial GaN HEMTs from reaching their full potential. Therefore, it is necessary to characterize the respective thermally resistive components that comprise the device’s thermal resistance and determine their contributions to the channel temperature rise. In this work, the thermal conductivity of the GaN channel/buffer layer and the effective thermal boundary resistance (TBR) of the GaN/substrate interface of a GaN-on-SiC wafer were measured using a frequency-domain thermoreflectance technique. The results were validated by both experiments and modeling of a transmission line measurement (TLM) structure fabricated on the GaN-on-SiC wafer. The limiting GaN/substrate thermal boundary conductance (TBC) beyond which there is no influence on the device temperature rise was then quantified for different device configurations. It was determined that this limiting TBC is a function of the substrate material, the direction in which heat primarily flows, and the channel temperature. The outcomes of this work provide device engineers with guidance in the design of epitaxial GaN wafers that will help minimize the device’s thermal resistance.
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Characterization of GaN-on-SiC Wafers using a Multi-Method Laser-Based Pump-Probe Technique
Gallium nitride (GaN) high electron mobility transistors (HEMTs) are key components of modern radio frequency (RF) power amplifiers. However, device self-heating negatively impacts both the performance and reliability of GaN HEMTs. Accordingly, laser-based pump-probe methods have been used to characterize the thermal resistance network of epitaxial material stacks that are used to fabricate HEMT structures. However, validation studies of these measurement results at the device level are lacking. In the present work, a GaN-on-SiC wafer was characterized using frequency-domain thermoreflectance and steady-state thermoreflectance techniques. The thermal conductivity of the GaN channel/buffer layer, SiC substrate, and the interfacial thermal boundary resistance at the GaN/SiC interface were determined. Results were validated by performing thermal imaging and modeling of a transmission line measurement (TLM) structure fabricated on the GaN-on-SiC wafer.
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- Award ID(s):
- 1934482
- PAR ID:
- 10498477
- Publisher / Repository:
- IEEE
- Date Published:
- Journal Name:
- 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
- ISBN:
- 979-8-3503-2166-1
- Page Range / eLocation ID:
- 1-4
- Format(s):
- Medium: X
- Location:
- Orlando, FL, USA
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
-
Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1109/ITherm55368.2023.10177642
