Two-dimensional (2D) molybdenum disulfide (MoS2) holds immense promise for next-generation electronic applications. However, the role of contact deposition at the metal/semiconductor interface remains a critical factor influencing device performance. This study investigates the impact of different metal deposition techniques, specifically electron-beam evaporation and sputtering, for depositing Cu, Pd, Bi, Sn, Pt, and In. Utilizing Raman spectroscopy with backside illumination, we observe changes at the buried metal/1L MoS2 interface after metal deposition. Sputter deposition causes more damage to monolayer MoS2 than electron-beam evaporation, as indicated by partial or complete disappearance of first-order E′(Γ)α and A′1(Γ)α Raman modes post-deposition. We correlated the degree of damage from sputtered atoms to the cohesive energies of the sputtered material. Through fabrication and testing of field-effect transistors, we demonstrate that electron-beam evaporated Sn/Au contacts exhibit superior performance including reduced contact resistance (~12×), enhanced mobility (~4.3×), and lower subthreshold slope (~0.6×) compared to their sputtered counterparts. Our findings underscore the importance of contact fabrication methods for optimizing the performance of 2D MoS2 devices and the value of Raman spectroscopy with backside illumination for gaining insight into contact performance. 
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                            Contact engineering for graphene nanoribbon devices
                        
                    
    
            Graphene nanoribbons (GNRs), when synthesized with atomic precision by bottom–up chemical approaches, possess tunable electronic structure, and high theoretical mobility, conductivity, and heat dissipation capabilities, which makes them an excellent candidate for channel material in post-silicon transistors. Despite their immense potential, achieving highly transparent contacts for efficient charge transport—which requires proper contact selection and a deep understanding of the complex one-dimensional GNR channel-three-dimensional metal contact interface—remains a challenge. In this study, we investigated the impact of different electron-beam deposited contact metals—the commonly used palladium (Pd) and softer metal indium (In)—on the structural properties and field-effect transistor performance of semiconducting nine-atom wide armchair GNRs. The performance and integrity of the GNR channel material were studied by means of a comprehensive Raman spectroscopy analysis, scanning tunneling microscopy (STM) imaging, optical absorption calculations, and transport measurements. We found that, compared to Pd, In contacts facilitate favorable Ohmic-like transport because of the reduction of interface defects, while the edge structure quality of GNR channel plays a more dominant role in determining the overall device performance. Our study provides a blueprint for improving device performance through contact engineering and material quality enhancements in emerging GNR-based technology. 
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                            - Award ID(s):
- 2235143
- PAR ID:
- 10503014
- Publisher / Repository:
- AIP Publishing
- Date Published:
- Journal Name:
- Applied Physics Reviews
- Volume:
- 10
- Issue:
- 4
- ISSN:
- 1931-9401
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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