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  • Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process
Title: Predicting Electrical Resistivity of Sintered Copper Nanoparticles From Simulations for the Microscale Selective Laser Sintering Process
One of the main challenges facing the expansion of Additive Manufacturing (AM) is the minimum feature sizes which these processes are able to achieve. Microscale Selective Laser Sintering (μ-SLS) is a novel Additive Manufacturing process created to meet this limitation by precisely laser sintering nanoparticles to give a better control over feature sizes. With the development of this new process, there is a concurrent need for models, which can predict the material properties of the sintering nanoparticles. To this end, this paper presents a novel simulation created to predict the electrical resistivity of sintered copper nanoparticles. Understanding the electrical resistivity of nanoparticles under sintering is useful for quantifying the rate of sintering and has applications such as predicting how the nanoparticles will fuse together when subjected to laser irradiation. Such a prediction allows for in situ corrections to be made to the sintering process to account for heat spreading beyond the intended laser irradiation targets. For these applications, it is important to ensure that the predictions of electrical resistivity from the simulations are accurate. This validation must be done against experimental data and since such experimental data does not currently exist, this paper also presents electrical resistivity data for the laser sintering of copper nanoparticles. In summary, this paper details the simulation methodology for predicting electrical resistivity of laser-sintered copper nanoparticles as well as validation of these simulations using electrical resistivity data from original sintering experiments. The key findings of this work are that the simulations can be used to predict electrical resistivity measurements for sintering of actual copper nanoparticles when the copper nanoparticles do not include other materials such as polymer coatings.  more » « less
Award ID(s):
2141044
PAR ID:
10512226
Author(s) / Creator(s):
; ; ; ; ; ;
Publisher / Repository:
ASME
Date Published:
Journal Name:
Journal of Micro- and Nano-Manufacturing
Volume:
11
Issue:
1
ISSN:
2166-0468
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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