Thermoelectric generators are being used as a successful power sources for space applications since 1960's in radioisotope-thermoelectric generators (RTGs) to supply power to space systems in deep space. RTG’s are capable of directly converting heat energy to uninterrupted electric power with no moving parts involved. The ability of thermoelectric materials to convert heat energy to electrical energy is defined by a dimensionless value known as the thermoelectric figure of merit (ZT) 1. This value quantifies the maximum thermoelectric efficiency of a thermoelectric generator (TEG) and is calculated by ZT= S2σT/κ, where S, σ, T, and κ represent Seebeck coefficient, electrical conductivity, temperature, and thermal conductivity, respectively. Among all of the thermoelectric materials, Bi2Te3 and its alloys have been reported to have high ZT values for low temperature energy harvesting and are highly suitable for powering wearables and self-powering sensors2, 3.
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Thermal analysis of thermoelectric active cooling including external thermal resistances
Thermoelectric active cooling uses nontraditional thermoelectric materials with high thermal conductivity, high thermoelectric power factor, and relatively low figure of merit (ZT) to transfer large heat flows from a hot object to a cold heat sink. However, prior studies have not considered the influence of external thermal resistances associated with the heat sinks or contacts, making it difficult to design active cooling thermal systems or compare the use of low-ZT and high-ZT materials. Here, we perform a non-dimensionalized analysis of thermoelectric active cooling under forced heat flow boundary conditions, including arbitrary external thermal resistances. We identify the optimal electrical currents to minimize the heat source temperature and find the crossover heat flows at which low-ZT active cooling leads to lower source temperatures than high-ZT and even ZT→+∞ thermoelectric refrigeration. These optimal parameters are insensitive to the thermal resistance between the heat source and thermoelectric materials, but depend strongly on the heat sink thermal resistance. Finally, we map the boundaries where active cooling yields lower source temperatures than thermoelectric refrigeration. For currently considered active cooling materials, active cooling with ZT < 0.1 is advantageous compared to ZT→+∞ refrigeration for dimensionless heat sink thermal conductances larger than 15 and dimensionless source powers between 1 and 100. Thus, our results motivate further investigation of system-level thermoelectric active cooling for applications in electronics thermal management.
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- Award ID(s):
- 2230727
- PAR ID:
- 10528039
- Publisher / Repository:
- AIP Publishing
- Date Published:
- Journal Name:
- Applied Physics Letters
- Volume:
- 123
- Issue:
- 24
- ISSN:
- 0003-6951
- Page Range / eLocation ID:
- 243901
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1063/5.0176286
