skip to main content
US FlagAn official website of the United States government
dot gov icon
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
https lock icon
Secure .gov websites use HTTPS
A lock ( lock ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.

Explore Research Products in the PAR
It may take a few hours for recently added research products to appear in PAR search results.


Title: Non-alloyed ohmic contacts to (010) β -Ga2O3 with low contact resistance
Low resistance non-alloyed ohmic contacts are realized by a metal-first process on homoepitaxial, heavily n+ doped (010) β-Ga2O3. The resulting contacts have a contact resistance (Rc) as low as 0.23 Ω-mm on an as-grown sample and exhibit nearly linear ohmic behavior even without a post-metallization anneal. The metal-first process was applied to form non-alloyed contacts on n+ (010) β-Ga2O3 grown by metal-organic chemical vapor deposition (MOCVD) as well as suboxide molecular beam epitaxy. Identical contacts fabricated on similar MOCVD samples by conventional liftoff processing exhibit highly rectifying Schottky behavior. Re-processing using the metal-first process after removal of the poor contacts by conventional methods does not improve the contacts; however, addition of a Ga-flux polishing step followed by re-processing using a metal-first process again results in low resistance, nearly linear ohmic contacts. The liftoff process, therefore, does not reliably render nearly linear ohmic behavior in non-alloyed contacts. Furthermore, no interface contamination was detected by x-ray photoelectron spectroscopy. This suggests that during the initial liftoff processing, a detrimental layer may form at the interface, likely modification of the Ga2O3 surface, that is not removable during the contact removal process but that can be removed by Ga-flux polishing.  more » « less
Award ID(s):
1719875
PAR ID:
10549330
Author(s) / Creator(s):
; ; ; ; ; ; ; ; ;
Publisher / Repository:
AIP Publishing
Date Published:
Journal Name:
Applied Physics Letters
Volume:
123
Issue:
24
ISSN:
0003-6951
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
More Like this
  1. ; ; ; ; ; (, Applied Physics Letters)
    Growing a thick high-quality epitaxial layer on the β-Ga2O3 substrate is crucial in commercializing β-Ga2O3 devices. Metal organic chemical vapor deposition (MOCVD) is also well-established for the large-scale commercial growth of β-Ga2O3 and related heterostructures. This paper presents a systematic study of the Schottky barrier diodes fabricated on two different Si-doped homoepitaxial β-Ga2O3 thin films grown on Sn-doped (001) and (010) β-Ga2O3 substrates by MOCVD. X-ray diffraction analysis of the MOCVD-grown sample, room temperature current density–voltage data for different Schottky diodes, and C–V measurements are presented. Diode characteristics, such as ideality factor, barrier height, specific on-resistance, and breakdown voltage, are studied. Temperature dependence (170–360 K) of the ideality factor, barrier height, and Poole–Frenkel reverse leakage mechanism are also analyzed from the J–V–T characteristics of the fabricated Schottky diodes. 
    more » « less
  2. ; ; ; ; ; ; ; (, Journal of Vacuum Science & Technology B)
    Thin (40–150 nm), highly doped n+ (1019–1020 cm−3) Ga2O3 layers deposited using pulsed laser deposition (PLD) were incorporated into Ti/Au ohmic contacts on (001) and (010) β-Ga2O3 substrates with carrier concentrations between 2.5 and 5.1 × 1018 cm−3. Specific contact resistivity values were calculated for contact structures both without and with a PLD layer having different thicknesses up to 150 nm. With the exception of a 40 nm PLD layer on the (001) substrate, the specific contact resistivity values decreased with increasing PLD layer thickness: up to 8× on (001) Ga2O3 and up to 16× on (010) Ga2O3 compared with samples without a PLD layer. The lowest average specific contact resistivities were achieved with 150 nm PLD layers: 3.48 × 10−5 Ω cm2 on (001) Ga2O3 and 4.79 × 10−5 Ω cm2 on (010) Ga2O3. Cross-sectional transmission electron microscopy images revealed differences in the microstructure and morphology of the PLD layers on the different substrate orientations. This study describes a low-temperature process that could be used to reduce the contact resistance in Ga2O3 devices. 
    more » « less
  3. ; ; (, Applied Physics Letters)
    Si-doped β-phase (010) Ga2O3 epi-films with fast growth rates were comprehensively investigated using trimethylgallium (TMGa) as the Ga precursor via metalorganic chemical vapor deposition (MOCVD). Two main challenges facing the MOCVD growth of thick (010) β-Ga2O3 films with fast growth rates include high impurity carbon (C) incorporation and rough surface morphologies due to the formation of imbedded 3D pyramid-shaped structures. In this work, two different categories of oxygen source (high-purity O2 > 99.9999% and O2* with 10 ppm of [H2O]) were used for β-Ga2O3 MOCVD growth. Our study revealed that the size and density of the 3D defects in the β-Ga2O3 epi-films were significantly reduced when the O2* was used. In addition, the use of off-axis (010) Ga2O3 substrates with 2° off-cut angle leads to further reduction of defect formation in β-Ga2O3 with fast growth rates. To suppress C incorporation in MOCVD β-Ga2O3 grown with high TMGa flow rates, our findings indicate that high O2 (or O2*) flow rates are essential. Superior room temperature electron mobilities as high as 110–190 cm2/V·s were achieved for β-Ga2O3 grown using O2* (2000 sccm) with a growth rate of 4.5 μm/h (film thickness of 6.3 μm) within the doping range of 1.3 × 1018–7 × 1015 cm−3. The C incorporation is significantly suppressed from ∼1018 cm−3 to <5 × 1016 cm−3 ([C] detection limit) for β-Ga2O3 grown using high O2 (O2*) flow rate of 2000 sccm. Results from this work will provide guidance on developing high-quality, thick β-Ga2O3 films required for high power electronic devices with vertical configurations. 
    more » « less
  4. ; ; ; ; ; (, Journal of Vacuum Science & Technology A)
    We report on the growth of Si-doped homoepitaxial β-Ga2O3 thin films on (010) Ga2O3 substrates via metal-organic chemical vapor deposition (MOCVD) utilizing triethylgallium (TEGa) and trimethylgallium (TMGa) precursors. The epitaxial growth achieved an impressive 9.5 μm thickness at 3 μm/h using TMGa, a significant advance in material growth for electronic device fabrication. This paper systematically studies the Schottky barrier diodes fabricated on the three MOCVD-grown films, each exhibiting variations in the epilayer thickness, doping levels, and growth rates. The diode from the 2 μm thick Ga2O3 epilayer with TEGa precursor demonstrates promising forward current densities, the lowest specific on-resistance, and the lowest ideality factor, endorsing TEGa’s potential for MOCVD growth. Conversely, the diode from the 9.5 μm thick Ga2O3 layer with TMGa precursor exhibits excellent characteristics in terms of lowest leakage current, highest on-off ratio, and highest reverse breakdown voltage of −510 V without any electric field management, emphasizing TMGa’s suitability for achieving high growth rates in Ga2O3 epilayers for vertical power electronic devices. 
    more » « less
  5. ; ; ; ; ; ; (, Proc. SPIE 12422, Oxide-based Materials and Devices)
    Teherani, Ferechteh H.; Rogers, David J. (Ed.)
    We demonstrated a metal-organic chemical vapor deposition (MOCVD) of smooth, thick, and monoclinic phase-pure gallium oxide (Ga2O3) on c-plane sapphire using silicon-oxygen bonding (SiOx) as a phase stabilizer. The corundum (α), monoclinic (β), and orthorhombic (ε) phases of Ga2O3 with a bandgap in the 4.4 – 5.1 eV range, are promising materials for power semiconductor devices and deep ultraviolet (UV) solar-blind photodetectors. The MOCVD systems are extensively used for homoepitaxial growth of β-Ga2O3 on (001), (100), (010), and (¯2 01) β-Ga2O3 substrates. These substrates are rare/expensive and have very low thermal conductivity; thus, are not suitable for high-power semiconductor devices. The c-plane sapphire is typically used as a substrate for high-power devices. The β-Ga2O3 grows in the (¯2 01) direction on sapphire. In this direction, the presence of high-density oxygen dangling bonds, frequent stacking faults, twinning, and other phases and planes impede the heteroepitaxy of thick β-Ga2O3. Previously phase stabilizations with SiOx have been reported for tetragonal and monoclinic hafnia. We were able to grow ~580nm thick β-Ga2O3 on sapphire by MOCVD at 750 oC through phase stabilization using silane. The samples grown with silane have a reduction in the surface roughness and resistivity from 10.7 nm to 4.4 nm and from 371.75 Ω.cm to 135.64 Ω.cm, respectively. These samples show a pure-monoclinic phase determined by x-ray diffraction (XRD); have tensile strain determined by Raman strain mapping. These results show that a thick, phase-pure -Ga2O3 can be grown on c-plane sapphire which can be suitable for creating power devices with better thermal management. 
    more » « less
  • Citation Formats
  • MLA
  • APA
  • Chicago
  • BibTeX
  • Save / Share this Record
  • Send to Email