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Featuring broadband operation and high efficiency, gallium nitride (GaN)-based radio frequency (RF) power amplifiers are key components to realize the next generation mobile network. However, to fully implement GaN high electron mobility transistors (HEMT) for such applications, it is necessary to overcome thermal reliability concerns stemming from localized extreme temperature gradients that form under high voltage and power operation. In this work, we developed a deep-ultraviolet thermoreflectance thermal imaging capability, which can potentially offer the highest spatial resolution among diffraction-limited far-field optical thermography techniques. Experiments were performed to compare device channel temperatures obtained from near-ultraviolet and deep-ultraviolet wavelength illumination sources for the proof of concept of the new characterization method. Deep-ultraviolet thermoreflectance imaging will facilitate the study of device self-heating within transistors based on GaN and emerging ultra-wide bandgap semiconductors (e.g., β-Ga2O3, AlxGa1-xN, and diamond) subjected to simultaneous extreme electric field and heat flux conditions.
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This content will become publicly available on June 1, 2026
Gallium Nitride High-Electron-Mobility Transistor-Based High-Energy Particle-Detection Preamplifier
GaN High-Electron-Mobility Transistors have gained some foothold in the power-electronics industry. This is due to wide frequency bandwidth and power handling. Gallium Nitride offers a wide bandgap and higher critical field strength compared to most wide-bandgap semiconductors, resulting in better radiation resistance. Theoretically, it supports higher speeds as the device dimensions could be reduced without suffering voltage breakdown. The simulation and experimental results illustrate the superior performance of the Gallium Nitride High-Electron-Mobility Transistors in an amplifying circuit. Using a spice model for commercially available Gallium Nitride High-Electron-Mobility Transistors, non-distorted output to an input signal of 200 ps was displayed. Real-world measurements underscore the fast response of the Gallium Nitride High-Electron-Mobility Transistors with its measured slew rate at approximately 3000 V/μs, a result only 17% lower than the result obtained from the simulation. This fast response, coupled with the amplifier radiation resistance, shows promise for designing improved detection and imaging circuits with long Mean Time Between Failure required, for example, by next-generation industrial-process gamma transmission-computed tomography.
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- Award ID(s):
- 2112556
- PAR ID:
- 10593299
- Publisher / Repository:
- MDPI
- Date Published:
- Journal Name:
- Metrology
- Volume:
- 5
- Issue:
- 2
- ISSN:
- 2673-8244
- Page Range / eLocation ID:
- 21
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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