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Two-dimensional (2D) molybdenum disulfide (MoS2) holds immense promise for next-generation electronic applications. However, the role of contact deposition at the metal/semiconductor interface remains a critical factor influencing device performance. This study investigates the impact of different metal deposition techniques, specifically electron-beam evaporation and sputtering, for depositing Cu, Pd, Bi, Sn, Pt, and In. Utilizing Raman spectroscopy with backside illumination, we observe changes at the buried metal/1L MoS2 interface after metal deposition. Sputter deposition causes more damage to monolayer MoS2 than electron-beam evaporation, as indicated by partial or complete disappearance of first-order E′(Γ)α and A′1(Γ)α Raman modes post-deposition. We correlated the degree of damage from sputtered atoms to the cohesive energies of the sputtered material. Through fabrication and testing of field-effect transistors, we demonstrate that electron-beam evaporated Sn/Au contacts exhibit superior performance including reduced contact resistance (~12×), enhanced mobility (~4.3×), and lower subthreshold slope (~0.6×) compared to their sputtered counterparts. Our findings underscore the importance of contact fabrication methods for optimizing the performance of 2D MoS2 devices and the value of Raman spectroscopy with backside illumination for gaining insight into contact performance.
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One-dimensional edge contact to encapsulated MoS2 with a superconductor
Establishing ohmic contact to van der Waals semiconductors such as MoS2 is crucial to unlocking their full potential in next-generation electronic devices. Encapsulation of few layer MoS2 with hBN preserves the material’s electronic properties but makes electrical contacts more challenging. Progress toward high quality edge contact to encapsulated MoS2 has been recently reported. Here, we evaluate a contact methodology using sputtered MoRe, a type II superconductor with a relatively high critical field and temperature commonly used to induce superconductivity in graphene. We find that the contact transparency is poor and that the devices do not support a measurable supercurrent down to 3 K, which has ramifications for future fabrication recipes.
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- PAR ID:
- 10597288
- Publisher / Repository:
- American Institute of Physics
- Date Published:
- Journal Name:
- AIP Advances
- Volume:
- 11
- Issue:
- 4
- ISSN:
- 2158-3226
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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