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A recently reported vision ray metrology technique [Opt. Express29,43480(2021)OPEXFF1094-408710.1364/OE.443550] measures geometric wavefronts with high precision. This paper introduces a method to convert these wavefront data into height information, focusing on the impact of back surface flatness and telecentricity errors on measurement accuracy. Systematic errors from these factors significantly affect height measurements. Using ray trace simulations, we estimate reconstruction errors with various plano-concave and plano-convex elements. We also developed a calibration technique to mitigate telecentricity errors, achieving submicron accuracy in surface reconstruction. This study provides practical insights into vision ray metrology systems, highlighting validity limits, emphasizing the importance of calibration for larger samples, and establishing system alignment tolerances. The reported technique for the conversion of geometric wavefronts to surface topography employs a direct non-iterative ray-tracing-free method. It is ideally suited for reference-free metrology with application to freeform optics manufacturing.
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A novel method for through-silicon via characterization based on diffraction fringe analysis
The precision metrology of through-hole silicon via (TSV) in the semiconductor industry has remained a critical challenge as its critical dimension (CD) reduces. In this letter, we report a novel method for TSV geometric feature measurement and characterization. By illuminating a collimated infrared laser beam to the TSV and then analyzing the TSV edge-induced diffraction interferometric fringe patterns, multiple geometric information of the TSV could be characterized, establishing its database. This computational approach to TSV characterization was validated by experiments. Being non-destructive and easy to deploy, this method provides a low cost and high efficiency solution for TSV metrology.
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- Award ID(s):
- 2426512
- PAR ID:
- 10630562
- Publisher / Repository:
- Ultramicroscopy
- Date Published:
- Journal Name:
- Ultramicroscopy
- Volume:
- 272
- Issue:
- C
- ISSN:
- 0304-3991
- Page Range / eLocation ID:
- 114136
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
-
Accepted Manuscript
- Journal Article:
- https://doi.org/10.1016/j.ultramic.2025.114136
