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This content will become publicly available on June 1, 2026

Title: BOARD # 447: Sowing the SEEDs (Scholars of Excellence in Engineering Design): Starting the SEED NSF S-STEM Program at Texas State University
Texas State University received an NSF S-STEM award to support two cohorts of talented, low-income engineering majors, with the first cohort starting their freshman year in Fall 2024. In addition to the scholarships awarded, this program aims to increase students’ engineering design self-efficacy, engineering identity, and improve persistence to graduation. The program includes unique strategies for achieving these goals, emphasizing mentoring and building a sense of community among participants. The SEED scholars were paired with a faculty mentor in their engineering major prior to their arrival on campus for their freshman year. This early contact was intended to open lines of communication with a faculty member, so the students felt they had a trustworthy source of information from someone who cared about them. As Texas State University has a high number of first-generation college students, there was an expectation that this program would likely attract a fair number of first-generation students. Without another family member’s experience about how to be a college student, having this faculty mentor gave these students a person who could help them answer questions and navigate the process leading to their first semester on campus. For instance, mentors were able to talk with students about dorm selection, mathematics course placement (including strategies for placing into a higher-level mathematics course), and what to expect in their engineering coursework. Student participation in an Engineering Living Learning Community (LLC) is another unique program feature to enhance community among the SEED scholars. A general description of the program and preliminary results from the students’ self-reported sense of belonging in engineering, engineering design self-efficacy, and engineering identity are presented in this paper.  more » « less
Award ID(s):
2322557
PAR ID:
10656668
Author(s) / Creator(s):
 ;  ;  ;  ;  
Publisher / Repository:
ASEE Conferences
Date Published:
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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