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Low resistance non-alloyed ohmic contacts are realized by a metal-first process on homoepitaxial, heavily n+ doped (010) β-Ga2O3. The resulting contacts have a contact resistance (Rc) as low as 0.23 Ω-mm on an as-grown sample and exhibit nearly linear ohmic behavior even without a post-metallization anneal. The metal-first process was applied to form non-alloyed contacts on n+ (010) β-Ga2O3 grown by metal-organic chemical vapor deposition (MOCVD) as well as suboxide molecular beam epitaxy. Identical contacts fabricated on similar MOCVD samples by conventional liftoff processing exhibit highly rectifying Schottky behavior. Re-processing using the metal-first process after removal of the poor contacts by conventional methods does not improve the contacts; however, addition of a Ga-flux polishing step followed by re-processing using a metal-first process again results in low resistance, nearly linear ohmic contacts. The liftoff process, therefore, does not reliably render nearly linear ohmic behavior in non-alloyed contacts. Furthermore, no interface contamination was detected by x-ray photoelectron spectroscopy. This suggests that during the initial liftoff processing, a detrimental layer may form at the interface, likely modification of the Ga2O3 surface, that is not removable during the contact removal process but that can be removed by Ga-flux polishing.
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Achieving 0.05 Ω-mm contact resistance in non-alloyed Ti/Au ohmics to β -Ga2O3 by removing surface carbon
Preserving a contamination-free metal–semiconductor interface in β-Ga2O3 is critical to achieve consistently low resistance (< 1 Ω-mm) ohmic contacts. Here, we report a scanning transmission electron microscopy study on the variation in Ti/Au ohmic contact quality to (010) β-Ga2O3 in a conventional lift-off vs a metal-first process. We observe a thin ∼1 nm carbon barrier between the Ti and Ga2O3 in a non-conductive contact fabricated by a conventional lift-off process, which we attribute to photoresist residue, not previously detected by x-ray photoelectron spectroscopy due to the thinness and patchy coverage of the carbon layer, as well as roughness of the Ga2O3 surface. This thin carbon barrier is confirmed by electron energy loss spectroscopy and atomic force microscopy-infrared spectroscopy. We believe that the presence of the thin and patchy carbon layer leads to the highly inconsistent contact behavior in previous reports on non-alloyed contacts. Adventitious carbon is also observed in a conductive ohmic contact metal-first processing on an as-grown sample. We find that a five minute active oxygen descum is sufficient to remove this carbon on as-grown samples, further improving the ohmic behavior and reducing the contact resistance Rc to 0.06 Ω-mm. We also show that an hour long UV-ozone treatment of the Ga2O3 surface can eliminate carbon residue from the lift-off processing, resulting in a low Rc of 0.05 Ω-mm.
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- Award ID(s):
- 2039380
- PAR ID:
- 10671097
- Publisher / Repository:
- AIP
- Date Published:
- Journal Name:
- APL Materials
- Volume:
- 13
- Issue:
- 6
- ISSN:
- 2166-532X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript
- Journal Article:
- https://doi.org/10.1063/5.0276786
