Gallium nitride high-electron-mobility transistors (GaN HEMTs) are at a point of rapid growth in defense (radar, SATCOM) and commercial (5G and beyond) industries. This growth also comes at a point at which the standard GaN heterostructures remain unoptimized for maximum performance. For this reason, we propose the shift to the aluminum nitride (AlN) platform. AlN allows for smarter, highly-scaled heterostructure design that will improve the output power and thermal management of III-nitride amplifiers. Beyond improvements over the incumbent amplifier technology, AlN will allow for a level of integration previously unachievable with GaN electronics. State-of-the-art high-current p-channel FETs, mature filter technology, and advanced waveguides, all monolithically integrated with an AlN/GaN/AlN HEMT, is made possible with AlN. It is on this new AlN platform that nitride electronics may maximize their full high-power, high-speed potential for mm-wave communication and high-power logic applications.
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A high-conductivity two-dimensional (2D) hole gas, analogous to the ubiquitous 2D electron gas, is desirable in nitride semiconductors for wide-bandgap p-channel transistors. We report the observation of a polarization-induced high-density 2D hole gas in epitaxially grown gallium nitride on aluminium nitride and show that such hole gases can form without acceptor dopants. The measured high 2D hole gas densities of about 5 × 10 13 per square centimeters remain unchanged down to cryogenic temperatures and allow some of the lowest p-type sheet resistances among all wide-bandgap semiconductors. The observed results provide a probe for studying the valence band structure and transport properties of wide-bandgap nitride interfaces.more » « less
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Electric Fields and Surface Fermi Level in Undoped GaN/AlN Two‐Dimensional Hole Gas Heterostructuresmore » « less
Undoped GaN/AlN heterostructures with a high‐density 2D hole gas (2DHG) have recently been reported, demonstrating that holes can be generated in GaN without magnesium (Mg) doping. The presence of the high‐density 2DHG in these GaN/AlN heterostructures is expected to result from huge internal polarization fields. Herein, modulation spectroscopy is applied to analyze the built‐in electric fields in the top GaN layer of molecular beam epitaxy (MBE)‐grown GaN/AlN heterostructures with a buried 2DHG using contactless electroreflectance (CER). Experimentally obtained electric field values are compared with self‐consistent Schrödinger–Poisson energy band calculations of the GaN/AlN structures. This coupled experimental and theoretical analysis determines that the Fermi level at the GaN surface is located at ≈1.9 above the valence band (i.e., roughly in the middle of the bandgap)—for structures with undoped and Mg‐doped GaN. Finally, the comparison of calculated 2DHG concentrations in the structures under study with values determined from Hall effect measurements shows excellent agreement further strengthening the result.
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Large‐area growth of polarization‐induced 2D hole gases (2DHGs) in a GaN/AlN heterostructure using molecular beam epitaxy (MBE) is demonstrated. A study of the effect of metal fluxes and substrate temperature during growth is conducted to optimize the 2DHG transport. These conditions are adopted for the growth on 2 in. wafer substrates. The obtained results represent a step forward towards achieving a GaN/AlN 2DHG platform for high‐performance wide‐bandgap p‐channel field effect transistors (FETs).
