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Understanding the thermal stability and degradation mechanism of β-Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs) is crucial for their high-power electronics applications. This work examines the high temperature performance of the junctionless lateral β-Ga2O3 FinFET grown on a native β-Ga2O3 substrate, fabricated by metal-assisted chemical etching with Al2O3 gate oxide and Ti/Au gate metal. The thermal exposure effect on threshold voltage (Vth), subthreshold swing (SS), hysteresis, and specific on-resistance (Ron,sp), as a function of temperature up to 298 °C, is measured and analyzed. SS and Ron,sp increased with increasing temperatures, similar to the planar MOSFETs, while a more severe negative shift of Vth was observed for the high aspect-ratio FinFETs here. Despite employing a much thicker epilayer (∼2 μm) for the channel, the high temperature performance of Ion/Ioff ratios and SS of the FinFET in this work remains comparable to that of the planar β-Ga2O3 MOSFETs reported using epilayers ∼10–30× thinner. This work paves the way for further investigation into the stability and promise of β-Ga2O3 FinFETs compared to their planar counterparts. 

In this work, β-Ga 2 O 3 fin field-effect transistors (FinFETs) with metalorganic chemical vapor deposition grown epitaxial Si-doped channel layer on (010) semi-insulating β-Ga 2 O 3 substrates are demonstrated. β-Ga 2 O 3 fin channels with smooth sidewalls are produced by the plasma-free metal-assisted chemical etching (MacEtch) method. A specific on-resistance (R on,sp ) of 6.5 mΩ·cm 2 and a 370 V breakdown voltage are achieved. In addition, these MacEtch-formed FinFETs demonstrate DC transfer characteristics with near zero (9.7 mV) hysteresis. The effect of channel orientation on threshold voltage, subthreshold swing, hysteresis, and breakdown voltages is also characterized. The FinFET with channel perpendicular to the [102] direction is found to exhibit the lowest subthreshold swing and hysteresis. 

Gallium oxide (Ga₂O₃) is a highly promising ultrawide‐bandgap semiconductor for power electronics that emerged about a decade ago. Epitaxial growth Ga₂O₃at the small scale is demonstrated. In order to develop scalable manufacturing of high‐performance epitaxial structures, in‐depth understanding of the fundamental growth processes, control parameters, and mechanism is imperative. This review discusses the recent progress in epitaxial growth of β‐Ga₂O₃films and highlights challenges in obtaining high growth rate, low defects, and high carrier mobilities. Compared with the other epitaxy methods, metal–organic chemical vapor deposition (MOCVD) offers a wider growth window and precursor selection option, to minimize the tradeoff between crystal quality and growth rate. Growth rate is inversely proportional to temperature, within a certain temperature window, because of the unavoidable premature gas‐phase reactions and desorption of the highly volatile gallium suboxide (Ga₂O) at elevated temperatures. Growth defects, background impurity incorporation, and carrier mobilities can be affected by the choice of MOCVD precursors, nucleation, and adsorption/desorption/diffusion of adatoms on substrate surfaces of different orientations, including the effect of growing on cleavage and noncleavage planes. This review summarizes the current status of the epitaxial growth of β‐Ga₂O₃and analyzes the major factors that enhance mobility and reduce background doping concentration. The insights gained help advance the manufacturability of device‐grade epitaxial thin films.