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The development of high performance wide-bandgap AlGaN channel transistors with high current densities and reduced Ohmic losses necessitates extremely highly doped, high Al content AlGaN epilayers for regrown source/drain contact regions. In this work, we demonstrate the achievement of semi-metallic conductivity in silicon (Si) doped N-polar Al0.6Ga0.4N grown on C-face 4H-SiC substrates by molecular beam epitaxy. Under optimized conditions, the AlGaN epilayer shows smooth surface morphology and a narrow photoluminescence spectral linewidth, without the presence of any secondary peaks. A favorable growth window is identified wherein the free electron concentration reaches as high as ∼1.8 × 1020 cm−3 as obtained from Hall measurements, with a high mobility of 34 cm2/V·s, leading to a room temperature resistivity of only 1 mΩ·cm. Temperature-dependent Hall measurements show that the electron concentration, mobility, and sheet resistance do not depend on temperature, clearly indicating dopant Mott transition to a semi-metallic state, wherein the activation energy (Ea) falls to 0 meV at this high value of Si doping for the AlGaN films. This achievement of semi-metallic conductivity in Si doped N-polar high Al content AlGaN is instrumental for advancing ultrawide bandgap electronic and optoelectronic devices. 

Interface engineering in heterostructures at the atomic scale has been a central research focus of nanoscale and quantum material science. Despite its paramount importance, the achievement of atomically ordered heterointerfaces has been severely limited by the strong diffusive feature of interfacial atoms in heterostructures. In this work, we first report a strong dependence of interfacial diffusion on the surface polarity. Near-perfect quantum interfaces can be readily synthesized on the semipolar plane instead of the conventionalc-plane of GaN/AlN heterostructures. The chemical bonding configurations on the semipolar plane can significantly suppress the cation substitution process as evidenced by first-principles calculations, which leads to an atomically sharp interface. Moreover, the surface polarity of GaN/AlN can be readily controlled by varying the strain relaxation process in core–shell nanostructures. The obtained extremely confined, interdiffusion-free ultrathin GaN quantum wells exhibit a high internal quantum efficiency of ~75%. Deep ultraviolet light-emitting diodes are fabricated utilizing a scalable and robust method and the electroluminescence emission is nearly free of the quantum-confined Stark effect, which is significant for ultrastable device operation. The presented work shows a vital path for achieving atomically ordered quantum heterostructures for III-nitrides as well as other polar materials such as III-arsenides, perovskites, etc. 

To date, it has remained challenging to achieve N-polar AlN, which is of great importance for high power, high frequency, and high temperature electronics, acoustic resonators and filters, ultraviolet (UV) optoelectronics, and integrated photonics. Here, we performed a detailed study of the molecular beam epitaxy and characterization of N-polar AlN on C-face 4H-SiC substrates. The N-polar AlN films grown under optimized conditions exhibit an atomically smooth surface and strong excitonic emission in the deep UV with luminescence efficiency exceeding 50% at room temperature. Detailed scanning transmission electron microscopy (STEM) studies suggest that most dislocations are terminated/annihilated within ∼200 nm AlN grown directly on the SiC substrate due to the relatively small (1%) lattice mismatch between AlN and SiC. The strain distribution of AlN is further analyzed by STEM and micro-Raman spectroscopy, and its impact on the temperature-dependent deep UV emission is elucidated. 

N-polar AlGaN is an emerging wide-bandgap semiconductor for next-generation high electron mobility transistors and ultraviolet light emitting diodes and lasers. Here, we demonstrate the growth and characterization of high-quality N-polar AlGaN films on C-face 4H-silicon carbide (SiC) substrates by molecular beam epitaxy. On optimization of the growth conditions, N-polar AlGaN films exhibit a crack free, atomically smooth surface (rms roughness ∼ 0.9 nm), and high crystal quality with low density of defects and dislocations. The N-polar crystallographic orientation of the epitaxially grown AlGaN film is unambiguously confirmed by wet chemical etching. We demonstrate precise compositional tunability of the N-polar AlGaN films over a wide range of Al content and a high internal quantum efficiency ∼74% for the 65% Al content AlGaN film at room temperature. Furthermore, controllable silicon (Si) doping in high Al content (65%) N-polar AlGaN films has been demonstrated with the highest mobility value ∼65 cm2/V-s observed corresponding to an electron concentration of 1.1 × 1017 cm−3, whereas a relatively high mobility value of 18 cm2/V-s is sustained for an electron concentration of 3.2 × 1019 cm−3, with an exceptionally low resistivity value of 0.009 Ω·cm. The polarity-controlled epitaxy of AlGaN on SiC presents a viable approach for achieving high-quality N-polar III-nitride semiconductors that can be harnessed for a wide range of emerging electronic and optoelectronic device applications. 

Two-dimensional (2D) hexagonal boron nitride (h-BN) is one of the few materials showing great promise for light emission in the far ultraviolet (UV)-C wavelength, which is more effective and safer in containing the transmission of microbial diseases than traditional UV light. In this report, we observed that h-BN, despite having an indirect energy bandgap, exhibits a remarkably high room-temperature quantum efficiency (∼60%), which is orders of magnitude higher than that of other indirect bandgap material, and is enabled by strong excitonic effects and efficient exciton-phonon interactions. This study offers a new approach for the design and development of far UV-C optoelectronic devices as well as quantum photonic devices employing 2D semiconductor active regions. 

Both two-dimensional (2D) transitional metal dichalcogenides (TMDs) and III–V semiconductors have been considered as potential platforms for quantum technology. While 2D TMDs exhibit a large exciton binding energy, and their quantum properties can be tailored via heterostructure stacking, TMD technology is currently limited by the incompatibility with existing industrial processes. Conversely, III-nitrides have been widely used in light-emitting devices and power electronics but not leveraging excitonic quantum aspects. Recent demonstrations of 2D III-nitrides have introduced exciton binding energies rivaling TMDs, promising the possibility to achieve room-temperature quantum technologies also with III-nitrides. Here, we discuss recent advancements in the synthesis and characterizations of 2D III-nitrides with a focus on 2D free-standing structures and embedded ultrathin quantum wells. We overview the main obstacles in the material synthesis, vital solutions, and the exquisite optical properties of 2D III-nitrides that enable excitonic and quantum-light emitters. 

Surface-emitting semiconductor lasers have been widely used in data communications, sensing, and recently in Face ID and augmented reality glasses. Here, we report the first achievement of an all-epitaxial, distributed Bragg reflector (DBR)–free electrically injected surface-emitting green laser by exploiting the photonic band edge modes formed in dislocation-free gallium nitride nanocrystal arrays, instead of using conventional DBRs. The device operates at ~523 nm and exhibits a threshold current of ~400 A/cm 2 , which is over one order of magnitude lower compared to previously reported blue laser diodes. Our studies open a new paradigm for developing low-threshold surface-emitting laser diodes from the ultraviolet to the deep visible (~200 to 600 nm), wherein the device performance is no longer limited by the lack of high-quality DBRs, large lattice mismatch, and substrate availability.