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  1. While the properties of β-Ga2O3 continue to be extensively studied for high-power applications, the effects of strong electric fields on the Ga2O3 microstructure and, in particular, the impact of electrically active native point defects have been relatively unexplored. We used cathodoluminescence point spectra and hyperspectral imaging to explore possible nanoscale movements of electrically charged defects in Ga2O3 vertical trench power diodes and observed the spatial rearrangement of optically active defects under strong reverse bias. These observations suggest an unequal migration of donor-related defects in β-Ga2O3 due to the applied electric field. The atomic rearrangement and possible local doping changes under extreme electric fields in β-Ga2O3 demonstrate the potential impact of nanoscale device geometry in other high-power semiconductor devices.

     
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  2. Abstract High-quality N-polar GaN p-n diodes are realized on single-crystal N-polar GaN bulk substrate by plasma-assisted molecular beam epitaxy. The room-temperature current–voltage characteristics reveal a high on/off current ratio of >10 11 at ±4 V and an ideality factor of 1.6. As the temperature increases to 200 °C, the apparent ideality factor gradually approaches 2. At such high temperatures, Shockley–Read–Hall recombination times of 0.32–0.46 ns are estimated. The measured electroluminescence spectrum is dominated by a strong near-band edge emission, while deep level and acceptor-related luminescence is greatly suppressed. 
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  3. The polarization difference and band offset between Al(Ga)N and GaN induce two-dimensional (2D) free carriers in Al(Ga)N/GaN heterojunctions without any chemical doping. A high-density 2D electron gas (2DEG), analogous to the recently discovered 2D hole gas in a metal-polar structure, is predicted in a N-polar pseudomorphic GaN/Al(Ga)N heterostructure on unstrained AlN. We report the observation of such 2DEGs in N-polar undoped pseudomorphic GaN/AlGaN heterostructures on single-crystal AlN substrates by molecular beam epitaxy. With a high electron density of ∼4.3 ×1013/cm2 that maintains down to cryogenic temperatures and a room temperature electron mobility of ∼450 cm2/V s, a sheet resistance as low as ∼320 Ω/◻ is achieved in a structure with an 8 nm GaN layer. These results indicate significant potential of AlN platform for future high-power RF electronics based on N-polar III-nitride high electron mobility transistors.

     
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  4. Multimode lasing at sub-300 nm wavelengths is demonstrated by optical pumping in AlGaN heterostructures grown on single-crystal AlN substrates by plasma-assisted molecular beam epitaxy. Edge-emitting ridge-based Fabry–Pérot cavities are fabricated with the epitaxial AlN/AlGaN double heterostructure by a combined inductively coupled plasma reactive ion etch and tetramethylammonium hydroxide etch. The emitters exhibit peak gain at 284 nm and modal linewidths on the order of 0.1 nm at room temperature. The applied growth technique and its chemical and heterostructural design characteristics offer certain unique capabilities toward further development of electrically injected AlGaN laser diodes. 
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