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The group III–V semiconductor photonic system is attractive to photonics engineers because it provides a complete set of photonic components. A plasmonic material that can be epitaxially integrated with the group III–V photonic system will potentially lead to many applications leveraging plasmonics and metamaterials. In this work, the shortest plasma wavelength ever reported in a III–V‐based material is demonstrated by epitaxially embedding ErAs into GaAs. This composite material acts as a tunable plasmonic material across the technologically important 2.68–6 µm infrared window. The growth window of this material is demonstrated to be much wider than other current heavily doped III–V plasmonic materials. Additionally, it is shown that the scattering rate can be reduced by increasing the growth temperature. The wide growth temperature range, designer plasmonic response, and the ease of epitaxial integration with other III–V semiconductor devices demonstrate the potential of ErAs:GaAs nanocomposites for the creation of a new type of metamaterial and other novel optoelectronic and nanophotonic applications.

 

Abstract Traditional photonic structures such as photonic crystals utilize (a) large arrays of small features with the same size and pitch and (b) a small number of larger features such as diffraction outcouplers. In conventional nanofabrication, separate lithography and etch steps are used for small and large features in order to employ process parameters that lead to optimal pattern transfer and side-wall profiles for each feature-size category, thereby overcoming challenges associated with reactive ion etching lag. This approach cannot be scaled to more complex photonic structures such as those emerging from inverse design protocols. Those structures include features with a large range of sizes such that no distinction between small and large can be made. We develop a sleeve and bulk etch protocol that can be employed to simultaneously pattern features over a wide range of sizes while preserving the desired pattern transfer fidelity and sidewall profiles. This approach reduces the time required to develop a robust process flow, simplifies the fabrication of devices with wider ranges of feature sizes, and enables the fabrication of devices with increasingly complex structure. 

Abstract Disorder is an essential parameter in photonic systems and devices, influencing phenomena such as the robustness of topological photonic states and the Anderson localization of modes in waveguides. We develop and demonstrate a method for both analyzing and visualizing positional, size, and shape disorder in periodic structures such as photonic crystals. This analysis method shows selectivity for disorder type and sensitivity to disorder down to less than 1%. We show that the method can be applied to more complex shapes such as those used in topological photonics. The method provides a powerful tool for process development and quality control, including analyzing the precision of E-Beam Lithography before patterns are transferred; quantifying the precision limits of lithography, deposition, or etch processes; and studying the intentional displacement of individual objects within otherwise periodic arrays.