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Abstract Beta gallium oxide (β‐Ga₂O₃) has emerged as a highly promising semiconductor material with an ultrawide bandgap ranging from 4.5 to 4.9 eV for future applications in power electronics, optoelectronics, as well as gas and ultraviolet (UV) radiation sensors. Here, surface adsorption and air damping behavior of doubly clamped β‐Ga₂O₃nanomechanical resonators are probed and systemically studied by measuring the resonance characteristics under different gas and pressure conditions. High responsivities of resonance to pressure are obtained by heating the devices up to 300 °C to induce an accelerated adsorption–desorption process. The initial surface conditions of the β‐Ga₂O₃thin film play important roles in affecting the resonant behavior. UV ozone treatment proves effective in altering the initial surface conditions of β‐Ga₂O₃nanosheets by eliminating physisorbed contaminants and filling oxygen vacancy defects residing on the surface, resulting in a consequential and discernible modification of the resonance behavior of β‐Ga₂O₃nanomechanical resonators. The surface adsorption and desorption processes in β‐Ga₂O₃demonstrate clear reversibility by exposing the UV treated β‐Ga₂O₃to air. This study attains first‐hand information on how the surface conditions of β‐Ga₂O₃affect its mechanical properties, and helps guide future development of transducers via β‐Ga₂O₃nanoelectromechanical systems (NEMS) for pressure sensing applications, especially in harsh environments. 

Microelectromechanical systems (MEMS) have emerged as highly attractive alternatives to conventional commercial off-the-shelf electronic sensors and systems due to their ability to offer miniature size, reduced weight, and low power consumption (i.e., SWaP advantages). These features make MEMS particularly appealing for a wide range of critical applications, including communication, biomedical, automotive, aerospace, and defense sectors. Resonant MEMS play crucial roles in these applications by providing precise timing references and channel selections for electronic devices, facilitating accurate filtering, mixing, synchronization, and tracking via their high stability and low phase noise. Additionally, they serve as key components in sensing applications, enabling detection and precise measurement of physical quantities for monitoring and control purposes across various fields. Temperature stability stands as a paramount performance specification for MEMS resonators and oscillators. It relates to the responsivity of a resonator's frequency to temperature variations and is typically quantified by the temperature coefficient of frequency (TCf). A constant and substantially large absolute TCf is preferred in MEMS temperature sensing applications, while a near-zero TCf is required for timing and other MEMS transducers that necessitate the decoupling of temperature effects on the resonance frequency. This comprehensive review aims to provide an in-depth overview of recent advancements in studying TCf in MEMS resonators. The review explores the compensation and engineering techniques employed across a range of resonator types, utilizing diverse materials. Various aspects are covered, including the design of MEMS resonators, theoretical analysis of TCf, temperature regulation techniques, and the metallization effect at high temperatures. The discussion encompasses TCf analysis of MEMS resonators operating in flexural, torsional, surface, and bulk modes, employing materials such as silicon (Si), lithium niobate (LiNbO3), silicon carbide (SiC), aluminum nitride (AlN), and gallium nitride (GaN). Furthermore, the review identifies areas that require continued development to fully exploit the TCf of MEMS resonators. 

We report on the experimental demonstration of aluminum scandium nitride (AlScN)-on-cubic silicon carbide (3C-SiC) Lamb wave resonators (LWRs) realized via microelectromechanical systems (MEMS) technology, operating at high temperature (T) up to T = 800 °C, while retaining robust electromechanical resonances at ∼27 MHz and good quality factor of Q ≈ 900 even at 800 °C. Measured resonances exhibit clear consistency and stability during heating and cooling processes, validating the AlScN-on-SiC LWRs can operate at high T up to 800 °C without noticeable degradation in moderate vacuum (∼20 mTorr). Even after undergoing four complete thermal cycles (heating from 23 to 800 °C and then cooling down to 23 °C), the devices exhibit robust resonance behavior, suggesting excellent stability and suitability for high-temperature applications. Q starts to decline as the temperature exceeds 400 °C, which can be attributed to energy dissipation mechanisms stemming from thermoelastic damping and intrinsic material loss originating from phonon–phonon interactions. 

We report on the experimental demonstration of high-performance suspended channel transistors with single- and bilayer (1L and 2L) molybdenum disulfide (MoS2), and on operating them as vibrating channel transistors (VCTs) and exploiting their built-in dynamic electromechanical coupling to read out picoampere (pA) transconduction current directly at the vibrating tones, without frequency conversion or down-mixing, for picometer (pm)-scale motion detection at room temperature. The 1L- and 2L-MoS2 VCTs exhibit excellent n-type transistor behavior with high mobility [150 cm2/(V·s)] and small subthreshold swing (98 mV/dec). Their resonance motions are probed by directly measuring the small-signal drain-source currents (iD). Electromechanical characteristics of the devices are extracted from the measured iD, yielding resonances at f0 = 31.83 MHz with quality factor Q = 117 and f0 = 21.43 MHz with Q = 110 for 1L- and 2L-MoS2 VCTs, respectively. The 2L-MoS2 VCT demonstrates excellent current and displacement sensitivity (Si1/2 = 2 pA/Hz1/2 and Sx1/2 = 0.5 pm/Hz1/2). We demonstrate f0 tuning by controlling gate voltage VG and achieve frequency tunability Δf0/f0 ≈ 8% and resonance frequency change Δf0/ΔVG ≈ 0.53 kHz/mV. This study helps pave the way to realizing ultrasensitive self-transducing 2D nanoelectromechanical systems at room temperature, in all-electronic configurations, for on-chip applications.