Mid-infrared trace gas sensing is a rapidly developing field with wide range of applications. Although CRDS, TDLAS, FTIR and others, can provide parts per billion and in some cases, parts per trillion sensitivities, these systems require bulky and expensive optical elements and, furthermore, are very sensitive to beam alignment and have significant size and weight that place constrains on their applications in the field, particularly for airborne or handheld platforms. Monolithic integration of light sources and detectors with an optically transparent passive photonics platform is required to enable a compact trace gas sensing system that is robust to vibrations and physical stress. Since the most efficient quantum cascade lasers (QCLs) demonstrated are in the InP platform, the choice of InGaAs-InP for passive photonics eliminates the need for costly wafer bonding versus silicon, germanium of GaAs, that would require optically absorbing bonding interfaces. The InGaAs-InP material platform can potentially cover the entire λ=3-15μm molecular fingerprint region. In this paper, we experimentally demonstrate monolithic integration of QCL, quantum cascade detector (QCD) and suspended membrane sub-wavelength waveguides in a fully monolithic InGaAs/InP material system. The transverse magnetic polarized QCL emission is efficiently coupled into an underlying InGaAs suspended membrane subwavelength waveguide. In addition to low-loss compact waveguide bends, the suspended membrane architecture offers a high analyte overlap integral with the analyte. The propagating light is absorbed at the peak absorbance wavelength of the selected analyte gas and the transduced signal is detected by the integrated QCD. Gas sensing will be demonstrated
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Compact integrated photonic components for lambda=3-15 micron
Chemicals are best recognized by their unique wavelength specific optical absorption signatures in the molecular fingerprint region from λ=3-15μm. In recent years, photonic devices on chips are increasingly being used for chemical and biological sensing. Silicon has been the material of choice of the photonics industry over the last decade due to its easy integration with silicon electronics as well as its optical transparency in the near-infrared telecom wavelengths. Silicon is optically transparent from 1.1 μm to 8 μm with research from several groups in the mid-IR. However, intrinsic material losses in silicon exceed 2dB/cm after λ~7μm (~0.25dB/cm at λ=6μm). In addition to the waveguiding core, an appropriate transparent cladding is also required. Available core-cladding choices such as Ge-GaAs, GaAs-AlGaAs, InGaAs-InP would need suspended membrane photonic crystal waveguide geometries. However, since the most efficient QCLs demonstrated are in the InP platform, the choice of InGaAs-InP eliminates need for wafer bonding versus other choices. The InGaAs-InP material platform can also potentially cover the entire molecular fingerprint region from λ=3-15μm. At long wavelengths, in monolithic architectures integrating lasers, detectors and passive sensor photonic components without wafer bonding, compact passive photonic integrated circuit (PIC) components are desirable to reduce expensive epi material loss in passive PIC etched areas. In this paper, we consider miniaturization of waveguide bends and polarization rotators. We experimentally demonstrate suspended membrane subwavelength waveguide bends with compact sub-50μm bend radius and compact sub-300μm long polarization rotators in the InGaAs/InP material system. Measurements are centered at λ=6.15μm for sensing ammonia
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- Award ID(s):
- 1711824
- NSF-PAR ID:
- 10090866
- Date Published:
- Journal Name:
- Proceedings of the SPIE
- Page Range / eLocation ID:
- 12
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Mid-infrared (mid-IR) absorption spectroscopy based on integrated photonic circuits has shown great promise in trace-gas sensing applications in which the mid-IR radiation directly interacts with the targeted analyte. In this paper, considering monolithic integrated circuits with quantum cascade lasers (QCLs) and quantum cascade detectors (QCDs), the InGaAs−InP platform is chosen to fabricate passive waveguide gas sensing devices. Fully suspended InGaAs waveguide devices with holey photonic crystal waveguides (HPCWs) and subwavelength grating cladding waveguides (SWWs) are designed and fabricated for mid-infrared sensing at λ = 6.15 μm in the low-index contrast InGaAs−InP platform. We experimentally detect 5 ppm ammonia with a 1 mm long suspended HPCW and separately with a 3 mm long suspended SWW, with propagation losses of 39.1 and 4.1 dB/cm, respectively. Furthermore, based on the Beer−Lambert infrared absorption law and the experimental results of discrete components, we estimated the minimum detectable gas concentration of 84 ppb from a QCL/QCD integrated SWW sensor. To the best of our knowledge, this is the first demonstration of suspended InGaAs membrane waveguides in the InGaAs−InP platform at such a long wavelength with gas sensing results. Also, this result emphasizes the advantage of SWWs to reduce the total transmission loss and the size of the fully integrated device’s footprint by virtue of its low propagation loss and TM mode compatibility in comparison to HPCWs. This study enables the possibility of monolithic integration of quantum cascade devices with TM polarized characteristics and passive waveguide sensing devices for on-chip mid-IR absorption spectroscopy.more » « less
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Abstract The development of compact and fieldable mid-infrared (mid-IR) spectroscopy devices represents a critical challenge for distributed sensing with applications from gas leak detection to environmental monitoring. Recent work has focused on mid-IR photonic integrated circuit (PIC) sensing platforms and waveguide-integrated mid-IR light sources and detectors based on semiconductors such as PbTe, black phosphorus and tellurene. However, material bandgaps and reliance on SiO2substrates limit operation to wavelengths
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Choquette, Kent D. ; Lei, Chun ; Graham, Luke A. (Ed.)A wafer-scale CMOS-compatible process for heterogeneous integration of III-V epitaxial material onto silicon for photonic device fabrication is presented. Transfer of AlGaAs-GaAs Vertical-Cavity Surface-Emitting Laser (VCSEL) epitaxial material onto silicon using a carrier wafer process and metallic bonding is used to form III-V islands which are subsequently processed into VCSELs. The transfer process begins with the bonding of III-V wafer pieces epitaxy-down on a carrier wafer using a temporary bonding material. Following substrate removal, precisely-located islands of material are formed using photolithography and dry etching. These islands are bonded onto a silicon host wafer using a thin-film non-gold metal bonding process and the transfer wafer is removed. Following the bonding of the epitaxial islands onto the silicon wafer, standard processing methods are used to form VCSELs with non-gold contacts. The removal of the GaAs substrate prior to bonding provides an improved thermal pathway which leads to a reduction in wavelength shift with output power under continuous-wave (CW) excitation. Unlike prior work in which fullyfabricated VCSELs are flip-chip bonded to silicon, all photonic device processing takes place after the epitaxial transfer process. The electrical and optical performance of heterogeneously integrated 850nm GaAs VCSELs on silicon is compared to their as-grown counterparts. The demonstrated method creates the potential for the integration of III-V photonic devices with silicon CMOS, including CMOS imaging arrays. Such devices could have use in applications ranging from 3D imaging to LiDAR.more » « less
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1117/12.2508885
