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1. Temperature-resilient solid-state organic artificial synapses for neuromorphic computing

   https://doi.org/10.1126/sciadv.abb2958  

   Melianas, A. ; Quill, T. J. ; LeCroy, G. ; Tuchman, Y. ; Loo, H. v. ; Keene, S. T. ; Giovannitti, A. ; Lee, H. R. ; Maria, I. P. ; McCulloch, I. ; et al ( July 2020 , Science Advances)

   Devices with tunable resistance are highly sought after for neuromorphic computing. Conventional resistive memories, however, suffer from nonlinear and asymmetric resistance tuning and excessive write noise, degrading artificial neural network (ANN) accelerator performance. Emerging electrochemical random-access memories (ECRAMs) display write linearity, which enables substantially faster ANN training by array programing in parallel. However, state-of-the-art ECRAMs have not yet demonstrated stable and efficient operation at temperatures required for packaged electronic devices (~90°C). Here, we show that (semi)conducting polymers combined with ion gel electrolyte films enable solid-state ECRAMs with stable and nearly temperature-independent operation up to 90°C. These ECRAMs show linear resistance tuning over a >2× dynamic range, 20-nanosecond switching, submicrosecond write-read cycling, low noise, and low-voltage (±1 volt) and low-energy (~80 femtojoules per write) operation combined with excellent endurance (>10 9 write-read operations at 90°C). Demonstration of these high-performance ECRAMs is a fundamental step toward their implementation in hardware ANNs. 

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2. Transparent InGaZnO-Based Resistive Random Access Memory

   Qin, Fei ; Lee, Sunghwan ( May 2022 , Materials Research Society)

   The major focus of artificial intelligence (AI) research is made on biomimetic synaptic processes that are mimicked by functional memory devices in the computer industry [1]. It is urgent to find a memory technology for suiting with Brain-Inspired Computing to break the von Neumann bottleneck which limits the efficiency of conventional computer architectures [2]. Silicon-based flash memory, which currently dominates the market for data storage devices, is facing challenging issues to meet the needs of future data storage device development due to the limitations, such as high-power consumption, high operation voltage, and low retention capacity [1]. The emerging resistive random-access memory (RRAM) has elicited intense research as its simple sandwiched structure, including top electrode (TE) layer, bottom electrode (BE) layer, and an intermediate resistive switching (RS) layer, can store data using RS phenomenon between the high resistance state (HRS) and the low resistance state (LRS). This class of emerging devices is expected to outperform conventional memory devices [3]. Specifically, the advantages of RRAM include low-voltage operation, short programming time, great cyclic stability, and good scalability [4]. Among the materials for RS layer, indium gallium zinc oxide (IGZO) has attracted attention because of its abundance and high atomic diffusion property of oxygen atoms, transparency, and its easily modulated electrical properties by controlling the stoichiometric ratio of indium and gallium as well as oxygen potential in the sputter gas [5, 6]. Moreover, since the IGZO can be applied to both the thin-film transistor (TFT) channel and RS layer, the IGZO-based fully integrated transparent electronics are very promising [5]. In this work, we proposed transparent IGZO-based RRAMs. First, we chose ITO to serve as both TE and BE to achieve high transmittance in the visible regime of light. All three layers (TE, RS, BE layers) were deposited using a multi-target magnetron sputtering system on glass substrates to demonstrate fully transparent oxide-based devices. I-V characteristics were evaluated by a semiconductor parameter analyzer, and our devices showed typical butterfly curves indicating the bipolar RS property. And the IGZO-based RRAM can survive more than 50 continuous sweeping cycles. The optical transmission analysis was carried out via an UV-Vis spectrometer and the average transmittance around 80% out of entire devices in the visible-light wavelength range, implying high transparency. To investigate the thickness dependence on the properties of RS layer, 50nm, 100nm and 150nm RS layer of IGZO RRAM were fabricated. Also, the oxygen partial pressure during the sputtering of IGZO was varied to optimize the property because the oxygen vacancy concentration governs the RS and RRAM performance. Electrode selection is crucial and can impact the performance of the whole device [7]. Thus, Cu TE was chosen for our second type of device because the diffusion of Cu ions can be beneficial for the formation the conductive filament (CF). Finally, a ~5 nm SiO2 barrier layer was employed between TE and RS layers to confine the diffusion of Cu into the RS layer. At the same time, this SiO2 inserting layer can provide an additional interfacial series resistance in the device to lower the off current, consequently, improve the on/off ratio and whole performance. In conclusion, the transparent IGZO-based RRAMs were established. To tune the property of RS layer, the thickness layer and sputtering conditions of RS were adjusted. In order to engineer the diffusion capability of the TE material to the RS layer and the BE, a set of TE materials and a barrier layer were integrated in IGZO-based RRAM and the performance was compared. Our encouraging results clearly demonstrate that IGZO is a promising material in RRAM applications and overcoming the bottleneck of current memory technologies. 

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3. Nanomicelles Array for Ultrahigh‐Density Data Storage

   https://doi.org/10.1002/smll.202202637  

   Wang, Guan ; Li, Hua ; Zhang, Qijian ; Zhang, Cheng ; Yuan, Junwei ; Wang, Yuxiang ; Lu, Jianmei ( July 2022 , Small)

   High‐density data storage devices based on organic and polymer materials are currently restricted by two key issues, size limitations and uniformity of memory cells. Herein, one triblock polymer is synthesized by ring‐opening metathesis polymerization, where the polymer contains an electron‐donor‐acceptor (A₁D) segment, an electron‐acceptor (A₂) segment, and a hydrophilic segment, that shows ternary memory behavior in a conventional sandwich‐type device. The polymers that have monodisperse molecular weight dispersity self‐assemble into nanomicelles with a uniform size of 80 nm. Each nanomicelle is composed of an A₁DA₂‐type hydrophobic core stabilized with a hydrophilic shell. Nanobowls based on conductive oxide are prepared via the template method, wherein the nanomicelles are present as independent nanoscale memory units to produce an array of micelle matrices. Investigations of the resulting nanomemory device using conductive atomic force microscopy show that the micelles exhibit a predominant semiconductor memory behavior. Compared to traditional ternary devices with a memory unit size of ≈1 mm, this innovative fabrication method based on arrayed uniform nanomicelles downscales the size of storage cells to 80 nm. Furthermore, the described system leads to a greatly enhanced storage density (>10⁸times over the same area), which opens up new paths for further development of ultrahigh‐density data storage devices.

    

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4. Architecting Optically Controlled Phase Change Memory

   https://doi.org/10.1145/3533252  

   Narayan, Aditya ; Thonnart, Yvain ; Vivet, Pascal ; Coskun, Ayse ; Joshi, Ajay ( December 2022 , ACM Transactions on Architecture and Code Optimization)

   Phase Change Memory (PCM) is an attractive candidate for main memory, as it offers non-volatility and zero leakage power while providing higher cell densities, longer data retention time, and higher capacity scaling compared to DRAM. In PCM, data is stored in the crystalline or amorphous state of the phase change material. The typical electrically controlled PCM (EPCM), however, suffers from longer write latency and higher write energy compared to DRAM and limited multi-level cell (MLC) capacities. These challenges limit the performance of data-intensive applications running on computing systems with EPCMs.

   Recently, researchers demonstrated optically controlled PCM (OPCM) cells with support for 5bits/cellin contrast to 2bits/cellin EPCM. These OPCM cells can be accessed directly with optical signals that are multiplexed in high-bandwidth-density silicon-photonic links. The higher MLC capacity in OPCM and the direct cell access using optical signals enable an increased read/write throughput and lower energy per access than EPCM. However, due to the direct cell access using optical signals, OPCM systems cannot be designed using conventional memory architecture. We need a complete redesign of the memory architecture that is tailored to the properties of OPCM technology.

   This article presents the design of a unified network and main memory system called COSMOS that combines OPCM and silicon-photonic links to achieve high memory throughput. COSMOS is composed of a hierarchical multi-banked OPCM array with novel read and write access protocols. COSMOS uses an Electrical-Optical-Electrical (E-O-E) control unit to map standard DRAM read/write commands (sent in electrical domain) from the memory controller on to optical signals that access the OPCM cells. Our evaluation of a 2.5D-integrated system containing a processor and COSMOS demonstrates2.14 ×average speedup across graph and HPC workloads compared to an EPCM system. COSMOS consumes3.8×lower read energy-per-bit and5.97×lower write energy-per-bit compared to EPCM. COSMOS is the first non-volatile memory that provides comparable performance and energy consumption as DDR5 in addition to increased bit density, higher area efficiency, and improved scalability.

    

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5. (Digital Presentation) Investigation of Top Electrodes Impact on Performance of Transparent Amorphous Indium Gallium Zinc Oxide (a-InGaZnO) Based Resistive Random Access Memory

   https://doi.org/10.1149/MA2022-01191075mtgabs  

   Qin, Fei ; Lee, Sunghwan ( July 2022 , ECS Meeting Abstracts)

   The traditional von Neumann architecture limits the increase in computing efficiency and results in massive power consumption in modern computers due to the separation of storage and processing units. The novel neuromorphic computation system, an in-memory computing architecture with low power consumption, is aimed to break the bottleneck and meet the needs of the next generation of artificial intelligence (AI) systems. Thus, it is urgent to find a memory technology to implement the neuromorphic computing nanosystem. Nowadays, the silicon-based flash memory dominates non-volatile memory market, however, it is facing challenging issues to achieve the requirements of future data storage device development due to the drawbacks, such as scaling issue, relatively slow operation speed, and high voltage for program/erase operations. The emerging resistive random-access memory (RRAM) has prompted extensive research as its simple two-terminal structure, including top electrode (TE) layer, bottom electrode (BE) layer, and an intermediate resistive switching (RS) layer. It can utilize a temporary and reversible dielectric breakdown to cause the RS phenomenon between the high resistance state (HRS) and the low resistance state (LRS). RRAM is expected to outperform conventional memory device with the advantages, notably its low-voltage operation, short programming time, great cyclic stability, and good scalability. Among the materials for RS layer, indium gallium zinc oxide (IGZO) has shown attractive prospects in abundance and high atomic diffusion property of oxygen atoms, transparency. Additionally, its electrical properties can be easily modulated by controlling the stoichiometric ratio of indium and gallium as well as oxygen potential in the sputter gas. Moreover, since the IGZO can be applied to both the thin-film transistor (TFT) channel and RS layer, it has a great potential for fully integrated transparent electronics application. In this work, we proposed amorphous transparent IGZO-based RRAMs and investigated switching behaviors of the memory cells prepared with different top electrodes. First, ITO was choosing to serve as both TE and BE to achieve high transmittance. A multi-target magnetron sputtering system was employed to deposit all three layers (TE, RS, BE layers) on glass substrate. I-V characteristics were evaluated by a semiconductor parameter analyzer, and the bipolar RS feature of our RRAM devices was demonstrated by typical butterfly curves. The optical transmission analysis was carried out via a UV-Vis spectrometer and the average transmittance was around 80% out of entire devices in the visible-light wavelength range, implying high transparency. We adjusted the oxygen partial pressure during the sputtering of IGZO to optimize the property because the oxygen vacancy concentration governs the RS performance. Electrode selection is crucial and can impact the performance of the whole device. Thus, Cu TE was chosen for our second type of device because the diffusion of Cu ions can be beneficial for the formation of the conductive filament (CF). A ~5 nm SiO 2 barrier layer was employed between TE and RS layers to confine the diffusion of Cu into the RS layer. At the same time, this SiO 2 inserting layer can provide an additional interfacial series resistance in the device to lower the off current, consequently, improve the on/off ratio and whole performance. Finally, an oxygen affinity metal Ti was selected as the TE for our third type of device because the concentration of the oxygen atoms can be shifted towards the Ti electrode, which provides an oxygengettering activity near the Ti metal. This process may in turn lead to the formation of a sub-stoichiometric region in the neighboring oxide that is believed to be the origin of better performance. In conclusion, the transparent amorphous IGZO-based RRAMs were established. To tune the property of RS layer, the sputtering conditions of RS were varied. To investigate the influence of TE selections on switching performance of RRAMs, we integrated a set of TE materials, and a barrier layer on IGZO-based RRAM and compared the switch characteristics. Our encouraging results clearly demonstrate that IGZO is a promising material in RRAM applications and breaking the bottleneck of current memory technologies. 

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