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Abstract The growing demand for flexible and wearable hybrid electronics has triggered the need for advanced manufacturing techniques with versatile printing capabilities. Complex ink formulations, use of surfactants/contaminants, limited source materials, and the need for high‐temperature heat treatments for sintering are major issues facing the current inkjet and aerosol printing methods. Here, the nanomanufacturing of flexible hybrid electronics (FHE) by dry printing silver and indium tin oxide on flexible substrates using a novel laser‐based additive nanomanufacturing process is reported. The electrical resistance of the printed lines is tailored during the print process by tuning the geometry and structure of the printed samples. Different FHE designs are fabricated and tested to check the performance of the devices. Mechanical reliability tests including cycling, bending, and stretching confirm the expected performance of the printed samples under different strain levels. This transformative liquid‐free process allows the on‐demand formation and in situ laser crystallization of nanoparticles for printing pure materials for future flexible and wearable electronics and sensors.
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Optimized Stress Testing for Flexible Hybrid Electronics Designs
Flexible hybrid electronics (FHE) is emerging as a promising solution to combine the benefits of printed electronics and silicon technology. FHE has many high-impact potential areas, such as wearable applications, health monitoring, and soft robotics, due to its physical advantages, which include light weight, low cost and the ability conform to different shapes. However, physical deformations in the field can lead to significant testing and validation challenges. For example, designers must ensure that FHE devices continue to meet their specs even when the components experience stress due to bending. Hence, physical deformation, which is hard to emulate, has to be part of the test procedures for FHE devices. This paper is the first to analyze stress experience at different parts of FHE devices under different bending conditions. We develop a novel methodology to maximize the test coverage with minimum number of text vectors with the help of a mixed integer linear programming formulation. We validate the proposed approach using an FHE prototype and COMSOL Multiphysics simulations.
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- Award ID(s):
- 1651624
- PAR ID:
- 10172806
- Date Published:
- Journal Name:
- 2019 IEEE 37th VLSI Test Symposium (VTS)
- Page Range / eLocation ID:
- 1 to 6
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1109/VTS.2019.8758661
