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Title: A Reconfigurable Interconnect Technology based on Spoof Plasmon
The bottleneck of inter-chip communication speed, for instance that between logic and memory units is a long-standing issue in acquiring ultra-fast computing. While research from two extreme ends of technologies: electrical, and optical interconnect have their own pitfall in constructing an energy-economic route of communication with high bandwidth density, a radically different technology named spoof plasmon based communication may bring new insight towards addressing the issue. This technology smoothly interweaves the advantages of electrical interconnect and that of optical ones. In the present work, we have given a proof-of-concept demonstration of the signal transfer capacity of spoof plasmon parallel data-bus. We demonstrated that the spoof plasmon channel can accommodate two different kinds of mode: electro-SSPP mode and optoSSPP mode. Depending on the data-traffic, SSPP channel can be dynamically reconfigured for supporting either of the two modes for information transfer in order to minimize energy consumption. In addition, we also endeavored to answer the question that whether the metasurface based information transfer system can be reliable in case of patterning irregularity induced by fabrication process variations.  more » « less
Award ID(s):
1727610
PAR ID:
10209217
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO)
Page Range / eLocation ID:
135-140
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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