Due to its fast switching speed, the voltage sharing of series-connected SiC MOSFETs is more sensitive to the parasitic components from the power modules and the system, which results in more challenges for voltage balancing control. For two series-connected SiC MOSFETs realized by one half-bridge module, the detailed analysis and measurement indicate that the unbalanced parasitic capacitors inside the power module comprise the dominant factor causing the difference of turn-off dv/dt. In this paper, the traditional gate turn-off delay-time control is first used as an example to analyze the limitation of the existing active voltage balancing (AVB) control methods under AC load current: 1) AVB control has a limitation to adjust delay time accurately under AC current; 2) the voltage imbalance of the body diodes cannot be solved by AVB control. To achieve voltage balancing control of series-connected SiC MOSFETs and body diodes, this paper proposes a new two-part hybrid approach: 1) passive dv/dt compensation: one small compensation capacitor is applied to balance the non-uniform distribution of parasitic capacitors inside the power module, so the series-connected MOSFETs can have the same turn-off dv/dt; 2) active gate signal turn-off time adjustment: a closed-loop delay time control is applied to compensate the gate signal mismatch of MOSFETs. To verify the proposed balancing approach, a single-phase pump-back test is conducted to show the improvement of voltage sharing of both MOSFETs and body diodes.
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A Review on Switching Slew Rate Control for Silicon Carbide Devices using Active Gate Drivers
Driving solutions for power semiconductor devices are experiencing new challenges since the emerging wide bandgap power devices, such as silicon carbide (SiC), with superior performance become commercially available. Generally, high switching speed is desired due to the lower switching loss, yet high dv/dt and di/dt can result in elevated electromagnetic interference (EMI) emission, false-triggering, and other detrimental effects during switching transients. Active gate drivers (AGDs) have been proposed to balance the switching losses and the switching speed of each switching transient. The review of the in-existence AGD methodologies for SiC devices has not been reported yet. This review starts with the essence of the slew rate control and its significance. Then a comprehensive review categorizing the state-of-the-art AGD methodologies is presented. It is followed by a summary of the AGDs control and timing strategies. In this work, using AGD to reduce the EMI noise of a 10 kV SiC MOSFET system is reported. This work also highlights other capabilities of AGDs including reliability enhancement of power devices and rebalancing the mismatched electrical parameters of parallel- and series-connected devices. These application scenarios of AGDs are validated via simulation and experimental results.
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- Award ID(s):
- 1939144
- NSF-PAR ID:
- 10215743
- Date Published:
- Journal Name:
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- ISSN:
- 2168-6777
- Page Range / eLocation ID:
- 1 to 1
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Abstract—Wide band gap (WBG) devices, like silicon carbide (SiC) MOSFET has gradually replaced the traditional silicon counterpart due to their advantages of high operating temperature and fast switching speed. Paralleling operations of SiC MOSFETs are unavoidable in high power applications in order to meet the system current requirement. However, parasitics mismatches among different paralleling devices would cause current unbalance issues, which would reduce the system reliability and maximum current capability. Thus, to achieve current balancing operation, this paper proposes a solution of using multi-level active gate driver, where the dynamic current sharing during turn-on and turn-off processes are achieved by adjusting the delays, intermediate turn-on and turn-off voltages. The static current sharing is maintained by regulating the static turn-on gate voltage, where the on-state resistance mismatch between different devices can be compensated. A double pulse test setup with two different SiC MOSFETs is built to emulate the scenario of worst case application with large differences of threshold voltage and on-state resistance. The experimental results demonstrate that the proposed active gate driver can achieve both dynamic and static current sharing operations for SiC MOSFETs with paralleling operation. Moreover, the system control diagram is discussed. Simulation studies are conducted to achieve closed-loop control of the paralleled SiC MOSFETs with the aid of the active gate driver approach.more » « less
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The wide bandgap semiconductors SiC and GaN are commercialized for power electronics and for visible to UV light-emitting diodes in the case of the GaN/InGaN/AlGaN materials system. For power electronics applications, SiC MOSFETs (metal–oxide–semiconductor field effect transistors) and rectifiers and GaN/AlGaN HEMTs and vertical rectifiers provide more efficient switching at high-power levels than do Si devices and are now being used in electric vehicles and their charging infrastructure. These devices also have applications in more electric aircraft and space missions where high temperatures and extreme environments are involved. In this review, their inherent radiation hardness, defined as the tolerance to total doses, is compared to Si devices. This is higher for the wide bandgap semiconductors, due in part to their larger threshold energies for creating defects (atomic bond strength) and more importantly due to their high rates of defect recombination. However, it is now increasingly recognized that heavy-ion-induced catastrophic single-event burnout in SiC and GaN power devices commonly occurs at voltages ∼50% of the rated values. The onset of ion-induced leakage occurs above critical power dissipation within the epitaxial regions at high linear energy transfer rates and high applied biases. The amount of power dissipated along the ion track determines the extent of the leakage current degradation. The net result is the carriers produced along the ion track undergo impact ionization and thermal runaway. Light-emitting devices do not suffer from this mechanism since they are forward-biased. Strain has also recently been identified as a parameter that affects radiation susceptibility of the wide bandgap devices.
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The wide bandgap semiconductors SiC and GaN are commercialized for power electronics and for visible to UV light-emitting diodes in the case of the GaN/InGaN/AlGaN materials system. For power electronics applications, SiC MOSFETs (metal–oxide–semiconductor field effect transistors) and rectifiers and GaN/AlGaN HEMTs and vertical rectifiers provide more efficient switching at high-power levels than do Si devices and are now being used in electric vehicles and their charging infrastructure. These devices also have applications in more electric aircraft and space missions where high temperatures and extreme environments are involved. In this review, their inherent radiation hardness, defined as the tolerance to total doses, is compared to Si devices. This is higher for the wide bandgap semiconductors, due in part to their larger threshold energies for creating defects (atomic bond strength) and more importantly due to their high rates of defect recombination. However, it is now increasingly recognized that heavy-ion-induced catastrophic single-event burnout in SiC and GaN power devices commonly occurs at voltages ∼50% of the rated values. The onset of ion-induced leakage occurs above critical power dissipation within the epitaxial regions at high linear energy transfer rates and high applied biases. The amount of power dissipated along the ion track determines the extent of the leakage current degradation. The net result is the carriers produced along the ion track undergo impact ionization and thermal runaway. Light-emitting devices do not suffer from this mechanism since they are forward-biased. Strain has also recently been identified as a parameter that affects radiation susceptibility of the wide bandgap devices.more » « less
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1109/JESTPE.2020.3008344
