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  • Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Title: Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Abstract Continuous rise in cloud computing and other web-based services propelled the data center proliferation seen over the past decade. Traditional data centers use vapor-compression-based cooling units that not only reduce energy efficiency but also increase operational and initial investment costs due to involved redundancies. Free air cooling and airside economization can substantially reduce the information technology equipment (ITE) cooling power consumption, which accounts for approximately 40% of energy consumption for a typical air-cooled data center. However, this cooling approach entails an inherent risk of exposing the ITE to harmful ultrafine particulate contaminants, thus, potentially reducing the equipment and component reliability. The present investigation attempts to quantify the effects of particulate contamination inside the data center equipment and ITE room using computational fluid dynamics (CFD). An analysis of the boundary conditions to be used was done by detailed modeling of ITE and the data center white space. Both two-dimensional and three-dimensional simulations were done for detailed analysis of particle transport within the server enclosure. An analysis of the effect of the primary pressure loss obstructions like heat sinks and dual inline memory modules inside the server was done to visualize the localized particle concentrations within the server. A room-level simulation was then conducted to identify the most vulnerable locations of particle concentration within the data center space. The results show that parameters such as higher velocities, heat sink cutouts, and higher aspect ratio features within the server tend to increase the particle concentration inside the servers.  more » « less
Award ID(s):
1738811
PAR ID:
10332512
Author(s) / Creator(s):
; ; ; ;
Date Published:
Journal Name:
Journal of Electronic Packaging
Volume:
144
Issue:
2
ISSN:
1043-7398
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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