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Title: A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Abstract The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types of ITE, each having its physical characteristics. Considering these geometrical and internal differences among ITE, it is infeasible to use the actual ITE as a self-simulator. Hence, a separate device called load bank is employed for that purpose. Load banks create a dummy thermal load to analyze, test, and stress the cooling infrastructure. Available commercial load banks do not accurately replicate a server's airflow patterns and transient heat signatures which are governed by thermal inertia, energy dissipation, flow resistance, and fan system behavior. In this study, a novel prototype of the server called server simulator was designed and built with different components to be used as a server mockup. The server simulator accurately captured air resistance, heat dissipation, and the functionality of actual server behavior. Experimental data showed up to 93% improvement in ITE passive and active flow curves using the designed server simulator compared to the commercial load bank. Furthermore, the experimental results demonstrated a below 5% discrepancy on the critical back pressure and free delivery point between the actual ITE and the designed server simulator. In addition, experimental data indicated that the developed server simulator improved the actual ITE thermal mass by 27% compared to the commercial load bank.  more » « less
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Journal of Electronic Packaging
Medium: X
Sponsoring Org:
National Science Foundation
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