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The increasing complexity of electronic systems in autonomous electric vehicles necessitates robust methods for forecasting the degradation of critical components such as printed circuit boards (PCBs). Various time series forecasting methods have been investigated to predict in-situ resistance degradation under vibration loads. However, these methods failed to capture the degradation trend under strong measurement noise. This paper introduces Monotonic Segmented Linear Regression (MSLR), a novel approach designed to capture monotonic degradation trends in time series data under significant measurement noise. By incorporating monotonic constraints, MSLR effectively models the non-decreasing behavior characteristic of degradation processes. To further enhance reliability of the prediction, we integrate Adaptive Conformal Inference (ACI) with MSLR, enabling the estimation of statistically valid upper bounds for resistance degradation with high confidence. Extensive experiments demonstrate that MSLR outperforms state-of-the-art time series forecasting baselines on real-world PCB degradation datasets.
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Viscoelastic Influence On the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
Abstract Structural components such as printed circuit boards (PCBs) are critical in the thermomechanical reliability assessment of electronic packages. Previous studies have shown that geometric parameters such as thickness and mechanical properties like elastic modulus of PCBs have direct influence on the reliability of electronic packages. Elastic material properties of PCBs are commonly characterized using equipment such as tensile testers and used in computational studies. However, in certain applications viscoelastic material properties are important. Viscoelastic influence on materials is evident when one exceeds the glass transition temperature of materials. Operating conditions or manufacturing conditions such as lamination and soldering may expose components to temperatures that exceed the glass transition temperatures. Knowing the viscoelastic behavior of the different components of electronic packages is important in order to perform accurate reliability assessment and design components such as printed circuit boards (PCBs) that will remain dimensionally stable after the manufacturing process. Previous researchers have used creep and stress relaxation test data to obtain the Prony series terms that represent the viscoelastic behavior and perform analysis. Others have used dynamic mechanical analysis in order to obtain frequency domain master curves that were converted to time domain before obtaining the Prony series terms. In this paper, nonlinear solvers were used on frequency domain master curve results from dynamic mechanical analysis to obtain Prony series terms and perform finite element analysis on the impact of adding viscoelastic properties when performing reliability assessment. The computational study results were used to perform comparative assessment to understand the impact of including viscoelastic behavior in reliability analysis under thermal cycling and drop testing for Wafer Level Chip Scale Packages.
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- Award ID(s):
- 1738811
- PAR ID:
- 10332776
- Date Published:
- Journal Name:
- Journal of Electronic Packaging
- ISSN:
- 1043-7398
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1115/1.4054784
