Recyclable and biodegradable microelectronics, i.e., “green” electronics, are emerging as a viable solution to the global challenge of electronic waste. Specifically, flexible circuit boards represent a prime target for materials development and increasing the utility of green electronics in biomedical applications. Circuit board substrates and packaging are good dielectrics, mechanically and thermally robust, and are compatible with microfabrication processes. Poly(octamethylene maleate (anhydride) citrate) (POMaC) – a citric acid-based elastomer with tunable degradation and mechanical properties – presents a promising alternative for circuit board substrates and packaging. Here, we report the characterization of Elastomeric Circuit Boards (ECBs). Synthesis and processing conditions were optimized to achieve desired degradation and mechanical properties for production of stretchable circuits. ECB traces were characterized and exhibited sheet resistance of 0.599 Ω cm−2, crosstalk distance of <0.6 mm, and exhibited stable 0% strain resistances after 1000 strain cycles to 20%. Fabrication of single layer and encapsulated ECBs was demonstrated.
Evaluation of commercially-available conductive filaments for 3D printing flexible circuits on paper
Three commercially-available conductive filaments were evaluated for 3D printing flexible circuits on paper. While all three filaments were printed successfully, the resulting conductive traces were found to have significantly different impedances when characterized by electrochemical impedance spectroscopy. Using a graphite-doped polylactic acid filament, the flexibility of paper-based conductive traces was evaluated, methods of integrating common electrical and electronic components with the conductive traces were demonstrated, and the resistive heating of the traces was characterized. The ability to 3D print conductive traces on paper using commercially available materials opens many opportunities for rapid prototyping of flexible electronics and for integrating electronic circuits with paper-based microfluidic devices.
- Award ID(s):
- 1709740
- Publication Date:
- NSF-PAR ID:
- 10343141
- Journal Name:
- PeerJ Materials Science
- Volume:
- 4
- Page Range or eLocation-ID:
- e21
- Sponsoring Org:
- National Science Foundation
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