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We investigate the beneficial effects of rapid thermal annealing on structure and photoluminescence of PbSe thin films on GaAs (001) grown below 150 °C, with a goal of low temperature integration for infrared optoelectronics. Thin films of PbSe deposited on GaAs by molecular beam epitaxy are epitaxial at these reduced growth temperatures, yet the films are highly defective with a mosaic grain structure with low angle and dendritic boundaries following coalescence. Remarkably, we find that rapid thermal annealing for as short as 180 s at temperatures between 300 and 425 °C in nitrogen ambient leads to extensive re-crystallization and transformation of these grain boundaries. The annealing at the same time dramatically improves the band edge luminescence at 3.7 μm from previously undetectable levels to nearly half as intense as our best conventionally grown PbSe films at 300 °C. We show using an analysis of laser pump-power dependent photoluminescence measurements that this dramatic improvement in the photoluminescence intensity is due to a reduction in the trap-assisted recombination. However, we find it much less correlated with improved structural parameters determined by x-ray diffraction rocking curves, thereby pointing to the importance of eliminating point defects over extended defects. Overall, the success of rapid thermal annealing in improving the luminescent properties of low growth temperature PbSe is a step toward the integration of PbSe infrared optoelectronics in low thermal budget, back end of line compatible fabrication processes.
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Elimination of Low-Angle Grain Boundary Networks in FeCrAl Alloys with the Electron Wind Force at a Low Temperature
Low-angle grain boundaries (LAGBs) accommodate residual stress through the rearrangement and accumulation of dislocations during cold rolling. This study presents an electron wind force-based annealing approach to recover cold-rolling induced residual stress in FeCrAl alloy below 100 °C in 1 min. This is significantly lower than conventional thermal annealing, which typically requires temperatures around 750 °C for about 1.5 h. A key feature of our approach is the athermal electron wind force effect, which promotes dislocation movement and stress relief at significantly lower temperatures. The electron backscattered diffraction (EBSD) analysis reveals that the concentration of low-angle grain boundaries (LAGBs) is reduced from 82.4% in the cold-rolled state to a mere 47.5% following electropulsing. This level of defect recovery even surpasses the pristine material’s initial state, which exhibited 54.8% LAGBs. This reduction in LAGB concentration was complemented by kernel average misorientation (KAM) maps and X-ray diffraction (XRD) Full Width at Half Maximum (FWHM) measurements, which further validated the microstructural enhancements. Nanoindentation tests revealed a slight increase in hardness despite the reduction in dislocation density, suggesting a balance between grain boundary refinement and dislocation dynamics. This proposed low-temperature technique, driven by athermal electron wind forces, presents a promising avenue for residual stress mitigation while minimizing undesirable thermal effects, paving the way for advancements in various material processing applications.
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- Award ID(s):
- 2103928
- PAR ID:
- 10507798
- Publisher / Repository:
- MDPI
- Date Published:
- Journal Name:
- Metals
- Volume:
- 14
- Issue:
- 3
- ISSN:
- 2075-4701
- Page Range / eLocation ID:
- 331
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.3390/met14030331
