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1. Defects and oxygen impurities in ferroelectric wurtzite Al1− x Sc x N alloys

   https://doi.org/10.1063/5.0211892  

   Lee, Cheng-Wei; Din, Naseem Ud; Brennecka, Geoff L; Gorai, Prashun (July 2024, Applied Physics Letters)

   III-nitrides and related alloys are widely used for optoelectronics and as acoustic resonators. Ferroelectric wurtzite nitrides are of particular interest because of their potential for direct integration with Si and wide bandgap semiconductors and unique polarization switching characteristics; such interest has taken off since the first report of ferroelectric Al1−xScxN alloys. However, the coercive fields needed to switch polarization are on the order of MV/cm, which are 1–2 orders of magnitude larger than oxide perovskite ferroelectrics. Atomic-scale point defects are known to impact the dielectric properties, including breakdown fields and leakage currents, as well as ferroelectric switching. However, very little is known about the native defects and impurities in Al1−xScxN and their effect on the dielectric and ferroelectric properties. In this study, we use first-principles calculations to determine the formation energetics of native defects and unintentional oxygen incorporation and their effects on the polarization switching barriers in Al1−xScxN alloys. We find that nitrogen vacancies are the dominant native defects, and unintentional oxygen incorporation on the nitrogen site is present in high concentrations. They introduce multiple mid-gap states that can lead to premature dielectric breakdown and increased temperature-activated leakage currents in ferroelectrics. We also find that nitrogen vacancy and substitutional oxygen reduce the switching barrier in Al1−xScxN at low Sc compositions. The effect is minimal or even negative (increases barrier) at higher Sc compositions. Unintentional defects are generally considered to adversely affect ferroelectric properties, but our findings reveal that controlled introduction of point defects by tuning synthesis conditions can instead benefit polarization switching in ferroelectric Al1−xScxN at certain compositions. 

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2. Ferroelectric behavior of sputter deposited Al0.72Sc0.28N approaching 5 nm thickness

   https://doi.org/10.1063/5.0147224  

   Zheng, Jeffrey X.; Fiagbenu, Merrilyn Mercy; Esteves, Giovanni; Musavigharavi, Pariasadat; Gunda, Akhil; Jariwala, Deep; Stach, Eric A.; Olsson, Roy H. (May 2023, Applied Physics Letters)

   Ferroelectric Al1−xScxN has raised much interest in recent years due to its unique ferroelectric properties and complementary metal oxide semiconductor back-end-of-line compatible processing temperatures. Potential applications in embedded nonvolatile memory, however, require ferroelectric materials to switch at relatively low voltages. One approach to achieving a lower switching voltage is to significantly reduce the Al1−xScxN thickness. In this work, ferroelectric behavior in 5–27 nm films of sputter deposited Al0.72Sc0.28N has been studied. We find that the 10 kHz normalized coercive field increases from 4.4 to 7.3 MV/cm when reducing the film thickness from 27.1 to 5.4 nm, while over the same thickness range, the characteristic breakdown field of a 12.5 μm radius capacitor increases from 8.3 to 12.1 MV/cm. The 5.4 nm film demonstrates ferroelectric switching at 5.5 V when excited with a 500 ns pulse and a switching speed of 60 ns. 

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3. Compensation of the Stress Gradient in Physical Vapor Deposited Al1−xScxN Films for Microelectromechanical Systems with Low Out-of-Plane Bending

   https://doi.org/10.3390/mi13081169  

   Beaucejour, Rossiny; D’Agati, Michael; Kalyan, Kritank; Olsson, Roy H. (August 2022, Micromachines)

   Thin film through-thickness stress gradients produce out-of-plane bending in released microelectromechanical systems (MEMS) structures. We study the stress and stress gradient of Al0.68Sc0.32N thin films deposited directly on Si. We show that Al0.68Sc0.32N cantilever structures realized in films with low average film stress have significant out-of-plane bending when the Al1−xScxN material is deposited under constant sputtering conditions. We demonstrate a method where the total process gas flow is varied during the deposition to compensate for the native through-thickness stress gradient in sputtered Al1−xScxN thin films. This method is utilized to reduce the out-of-plane bending of 200 µm long, 500 nm thick Al0.68Sc0.32N MEMS cantilevers from greater than 128 µm to less than 3 µm. 

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4. From prediction to experimental realization of ferroelectric wurtzite Al1− x Gd x N alloys

   https://doi.org/10.1063/5.0251168  

   Lee, Cheng-Wei; Smaha, Rebecca W; Brennecka, Geoff L; Haegel, Nancy M; Gorai, Prashun; Yazawa, Keisuke (February 2025, APL Materials)

   AlN-based alloys find widespread application in high-power microelectronics, optoelectronics, and electromechanics. The realization of ferroelectricity in wurtzite AlN-based heterostructural alloys has opened up the possibility of directly integrating ferroelectrics with conventional microelectronics based on tetrahedral semiconductors, such as Si, SiC, and III–Vs, enabling compute-in-memory architectures, high-density data storage, and more. The discovery of AlN-based wurtzite ferroelectrics has been driven to date by chemical intuition and empirical explorations. Here, we demonstrate the computationally-guided discovery and experimental demonstration of new ferroelectric wurtzite Al1−xGdxN alloys. First-principles calculations indicate that the minimum energy pathway for switching changes from a collective to an individual switching process with a lower overall energy barrier, at a rare-earth fraction x with x > 0.10–0.15. Experimentally, ferroelectric switching is observed at room temperature in Al1−xGdxN films with x > 0.12, which strongly supports the switching mechanisms in wurtzite ferroelectrics proposed previously [Lee et al., Sci. Adv. 10, eadl0848 (2024)]. This is also the first demonstration of ferroelectricity in an AlN-based alloy with a magnetic rare-earth element, which could pave the way for additional functionalities such as multiferroicity and opto-ferroelectricity in this exciting class of AlN-based materials. 

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5. Nanoscale compositional segregation in epitaxial AlScN on Si (111)

   https://doi.org/10.1039/d2nh00567k  

   Zhang, Xiaoman; Stach, Eric A.; Meng, W. J.; Meng, Andrew C. (March 2023, Nanoscale Horizons)

   We report the growth of epitaxial wurtzite AlScN thin films on Si (111) substrates with a wide range of Sc concentrations using ultra-high vacuum reactive sputtering. Sc alloying in AlN enhances piezoelectricity and induces ferroelectricity, and epitaxial thin films facilitate systematic structure-based investigations of this important and emerging class of materials. Two main effects are observed as a function of increasing Sc concentration. First, increasing crystalline disorder is observed together with a structural transition from wurtzite to rocksalt at ∼30 at% Sc. Second, nanoscale compositional segregation consistent with spinodal decomposition occurs at intermediate compositions, before the wurtzite to rocksalt phase boundary is reached. Lamellar features arising from composition fluctuations are correlated with polarization domains in AlScN, suggesting that composition segregation can influence ferroelectric properties. The present results provide a route to the creation of single crystal AlScN films on Si (111), as well as a means for self-assembled composition modulation. 

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