Dry oxidation of Si (001) beneath a thin epitaxial SrTiO3 layer has been studied using furnace annealing in flowing oxygen. A 10-nm layer of SrTiO3 is epitaxially grown on Si with no SiO2 interlayer. For such a structure, an annealing temperature of 800 °C was found to be the limiting temperature to prevent silicate formation and disruption of the interface structure. The effect of annealing time on the thickness of the SiO2 layer was investigated. In situ x-ray photoelectron spectroscopy and reflection-high-energy electron diffraction were used to ensure that the quality of SrTiO3 is unchanged after the annealing process. The experimental annealing data are compared with a theoretical oxygen diffusion model based on that of Deal, Grove, and Massoud. The model fits the experimental data well, indicating that oxygen diffusion through the SrTiO3 layer is not the limiting factor. One can therefore readily control the thickness of the SiO2 interlayer by simply controlling the annealing time in flowing oxygen. 
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                            Probing electronic dead layers in homoepitaxial n -SrTiO3(001) films
                        
                    
    
            We combine state-of-the-art oxide epitaxial growth by hybrid molecular beam epitaxy with transport, x-ray photoemission, and surface diffraction, along with classical and first-principles quantum mechanical modeling to investigate the nuances of insulating layer formation in otherwise high-mobility homoepitaxial n-SrTiO3(001) films. Our analysis points to charge immobilization at the buried n-SrTiO3/undoped SrTiO3(001) interface as well as within the surface contamination layer resulting from air exposure as the drivers of electronic dead-layer formation. As Fermi level equilibration occurs at the surface and the buried interface, charge trapping reduces the sheet carrier density (n2D) and renders the n-STO film insulating if n2D falls below the critical value for the metal-to-insulator transition. 
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                            - Award ID(s):
- 2011401
- PAR ID:
- 10594683
- Publisher / Repository:
- American Institute of Physics
- Date Published:
- Journal Name:
- APL Materials
- Volume:
- 10
- Issue:
- 7
- ISSN:
- 2166-532X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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