skip to main content
US FlagAn official website of the United States government
dot gov icon
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
https lock icon
Secure .gov websites use HTTPS
A lock ( lock ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.

Explore Research Products in the PAR
It may take a few hours for recently added research products to appear in PAR search results.


Title: Growth of a -plane BaTiO3 on a -plane β -Ga2O3 by molecular-beam epitaxy
We demonstrate the epitaxial growth of single-phase (100) BaTiO3 films on (100) β-Ga2O3 substrates at substrate temperatures ranging from 600 to 700 °C using molecular-beam epitaxy. Characterization of a 47 nm thick BaTiO3 film by atomic force microscopy reveals a step-and-terrace morphology with unit-cell-high BaTiO3 steps and an rms surface roughness of 0.26 nm. Scanning transmission electron microscopy (STEM) images show that in some regions the β-Ga2O3 substrate terminates with a (100)A plane as it transitions to BaTiO3 and in other regions with a (100)B plane. The (100) BaTiO3 films are fully relaxed and consist of a mixture of two types of a-axis domains: a1 and a2. The orientation relationship determined by X-ray diffraction and confirmed by STEM is (100) BaTiO3 || (100) β-Ga2O3 and [011] BaTiO3||[010] β-Ga2O3. Despite the average linear lattice mismatch of 3.8%, BaTiO3 films with rocking curve full width at half maximum widths as narrow as 28 arc sec are achieved. From capacitance–voltage measurements on a metal–oxide–semiconductor capacitor structure with a-axis BaTiO3 as the oxide layer and Si-doped β-Ga2O3 as the semiconducting layer, we extract a dielectric constant of K11 = 670 for the BaTiO3 epitaxially integrated with (100) β-Ga2O3. We anticipate that this high-K epitaxial dielectric will be useful for electric-field management in β-Ga2O3-based device structures.  more » « less
Award ID(s):
2039380
PAR ID:
10671044
Author(s) / Creator(s):
; ; ; ; ; ; ; ; ; ; ; ;
Publisher / Repository:
AIP Publishing
Date Published:
Journal Name:
APL Materials
Volume:
14
Issue:
1
ISSN:
2166-532X
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
More Like this
  1. ; ; ; ; ; ; (, Proc. SPIE 12422, Oxide-based Materials and Devices)
    Teherani, Ferechteh H.; Rogers, David J. (Ed.)
    We demonstrated a metal-organic chemical vapor deposition (MOCVD) of smooth, thick, and monoclinic phase-pure gallium oxide (Ga2O3) on c-plane sapphire using silicon-oxygen bonding (SiOx) as a phase stabilizer. The corundum (α), monoclinic (β), and orthorhombic (ε) phases of Ga2O3 with a bandgap in the 4.4 – 5.1 eV range, are promising materials for power semiconductor devices and deep ultraviolet (UV) solar-blind photodetectors. The MOCVD systems are extensively used for homoepitaxial growth of β-Ga2O3 on (001), (100), (010), and (¯2 01) β-Ga2O3 substrates. These substrates are rare/expensive and have very low thermal conductivity; thus, are not suitable for high-power semiconductor devices. The c-plane sapphire is typically used as a substrate for high-power devices. The β-Ga2O3 grows in the (¯2 01) direction on sapphire. In this direction, the presence of high-density oxygen dangling bonds, frequent stacking faults, twinning, and other phases and planes impede the heteroepitaxy of thick β-Ga2O3. Previously phase stabilizations with SiOx have been reported for tetragonal and monoclinic hafnia. We were able to grow ~580nm thick β-Ga2O3 on sapphire by MOCVD at 750 oC through phase stabilization using silane. The samples grown with silane have a reduction in the surface roughness and resistivity from 10.7 nm to 4.4 nm and from 371.75 Ω.cm to 135.64 Ω.cm, respectively. These samples show a pure-monoclinic phase determined by x-ray diffraction (XRD); have tensile strain determined by Raman strain mapping. These results show that a thick, phase-pure -Ga2O3 can be grown on c-plane sapphire which can be suitable for creating power devices with better thermal management. 
    more » « less
  2. ; ; ; ; ; ; ; ; ; ; et al (, APL Materials)
    We report the use of suboxide molecular-beam epitaxy (S-MBE) to grow α-(AlxGa1−x)2O3 films on (110) sapphire substrates over the 0 < x < 0.95 range of aluminum content. In S-MBE, 99.98% of the gallium-containing molecular beam arrives at the substrate in a preoxidized form as gallium suboxide (Ga2O). This bypasses the rate-limiting step of conventional MBE for the growth of gallium oxide (Ga2O3) from a gallium molecular beam and allows us to grow fully epitaxial α-(AlxGa1−x)2O3 films at growth rates exceeding 1 µm/h and relatively low substrate temperature (Tsub = 605 ± 15 °C). The ability to grow α-(AlxGa1−x)2O3 over the nominally full composition range is confirmed by Vegard’s law applied to the x-ray diffraction data and by optical bandgap measurements with ultraviolet–visible spectroscopy. We show that S-MBE allows straightforward composition control and bandgap selection for α-(AlxGa1−x)2O3 films as the aluminum incorporation x in the film is linear with the relative flux ratio of aluminum to Ga2O. The films are characterized by atomic-force microscopy, x-ray diffraction, and scanning transmission electron microscopy (STEM). These α-(AlxGa1−x)2O3 films grown by S-MBE at record growth rates exhibit a rocking curve full width at half maximum of ≊ 12 arc secs, rms roughness <1 nm, and are fully commensurate for x ≥ 0.5 for 20–50 nm thick films. STEM imaging of the x = 0.78 sample reveals high structural quality and uniform composition. Despite the high structural quality of the films, our attempts at doping with silicon result in highly insulating films. 
    more » « less
  3. ; ; ; (, Journal of Applied Physics)
    β-phase gallium oxide (Ga2O3) is an emerging ultrawide bandgap (UWBG) semiconductor with a bandgap energy of ∼ 4.8 eV and a predicted high critical electric field strength of ∼8 MV/cm, enabling promising applications in next generation high power electronics and deep ultraviolet optoelectronics. The advantages of Ga2O3 also stem from its availability of single crystal bulk native substrates synthesized from melt, and its well-controllable n-type doping from both bulk growth and thin film epitaxy. Among several thin film growth methods, metalorganic chemical vapor deposition (MOCVD) has been demonstrated as an enabling technology for developing high-quality epitaxy of Ga2O3 thin films, (AlxGa1−x)2O3 alloys, and heterostructures along various crystal orientations and with different phases. This tutorial summarizes the recent progresses in the epitaxial growth of β-Ga2O3 thin films via different growth methods, with a focus on the growth of Ga2O3 and its compositional alloys by MOCVD. The challenges for the epitaxial development of β-Ga2O3 are discussed, along with the opportunities of future works to enhance the state-of-the-art device performance based on this emerging UWBG semiconductor material system. 
    more » « less
  4. ; ; ; ; ; ; ; ; ; ; et al (, Journal of Applied Physics)
    This study investigates minority electron diffusion length and carrier recombination phenomena in p-type 300 nm-thick Ga2O3 films homoepitaxially grown over a (001) tin-doped β-Ga2O3 conductive substrate. This research is novel due to its systematic and near-simultaneous measurements in the top layer of a p-Ga2O3/n-Ga2O3 structure using independent electron beam-induced current and cathodoluminescence techniques. Previous work primarily focused on heteroepitaxial architectures or gallium oxide grown over insulating substrates of the same material. In this work, the activation energies related to point defects in gallium oxide were extracted from temperature-dependent incremental electron beam irradiation experiments to gain insight into the defect landscape and its influence on minority carrier transport and recombination dynamics. 
    more » « less
  5. ; ; ; ; ; ; ; (, Journal of Vacuum Science & Technology B)
    Thin (40–150 nm), highly doped n+ (1019–1020 cm−3) Ga2O3 layers deposited using pulsed laser deposition (PLD) were incorporated into Ti/Au ohmic contacts on (001) and (010) β-Ga2O3 substrates with carrier concentrations between 2.5 and 5.1 × 1018 cm−3. Specific contact resistivity values were calculated for contact structures both without and with a PLD layer having different thicknesses up to 150 nm. With the exception of a 40 nm PLD layer on the (001) substrate, the specific contact resistivity values decreased with increasing PLD layer thickness: up to 8× on (001) Ga2O3 and up to 16× on (010) Ga2O3 compared with samples without a PLD layer. The lowest average specific contact resistivities were achieved with 150 nm PLD layers: 3.48 × 10−5 Ω cm2 on (001) Ga2O3 and 4.79 × 10−5 Ω cm2 on (010) Ga2O3. Cross-sectional transmission electron microscopy images revealed differences in the microstructure and morphology of the PLD layers on the different substrate orientations. This study describes a low-temperature process that could be used to reduce the contact resistance in Ga2O3 devices. 
    more » « less
  • Citation Formats
  • MLA
  • APA
  • Chicago
  • BibTeX
  • Text Encoded Conversion
  • XML
  • Save / Share this Record
  • Send to Email