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In recent years, electronic packaging has evolved significantly to meet demands for higher performance, lower costs, and smaller designs. This shift has led to heterogeneous packaging, which integrates chips of varying stack heights and results in non-uniform heat flux and temperature distributions. These conditions pose substantial thermal management challenges, as they can create large temperature gradients, which increase thermal stress and potentially compromise chip reliability. This study explores single-phase liquid cooling for multi-chip modules (MCMs) through a comprehensive experimental and machine learning approach. It investigates the impact of chip spacing, height, fluid flow rate, fluid inlet location, and heat flux uniformity on chip temperature and the thermohydraulic performance of a commercial cold plate. Results show that increasing coolant flow from 1 LPM to 2 LPM decreased thermal resistance by 26 %, with heat losses remaining below 5 %. The left inlet configuration improved temperature uniformity compared to the right, though both yielded comparable thermal performance. Adjusting heater spacing impacted temperature distribution based on inlet position, and lowering one heater by 1 mm raised its temperatures by 15 ◦C due to increased thermal resistance from thermal interface material. A transient test demonstrated the cold plate’s quick response to power surges, in which there is only a 1 ◦C spike above steady state. Complementing these findings, an Artificial Neural Network (ANN) model was developed with optimized architecture specifically for the unique challenges of this study. The ANN model was rigorously validated using an independent dataset, achieving highly accurate temperature predictions (R2 = 0.99) within 2.5 % of experimental 

The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed for heterogeneous packaging, where computer chips with different stack heights are closely packed, creating nonuniform heat flux and temperature and additional challenges for thermal management. Without implementing an appropriate thermal management strategy for heterogeneous packages, large temperature gradients can be observed within the package, which would increase the thermal stresses on the chip and raise reliability issues. To mimic this real-life scenario of such packaging, an experimental setup was designed and built. The design of the new experimental setup consists of four identical 1.2 cm × 1.2 cm ceramic heaters, each of which is connected to a separate power supply and can reach a heat flux of 140 W/cm2. Accordingly, this mock package is capable of delivering different power levels to mimic different multicore microprocessor conditions. To give the heater the ability to move precisely in the x-, y-, and z-directions, each heater is mounted to an XYZ linear stage. Deionized water (DI) was used as the working fluid, and a pin-fin heat sink was used to run the initial steady-state tests on the experimental rig. The tests showed how different flow rates at a constant fluid temperature and input power affect the temperatures of the heaters and the thermohydraulic performance of the heat sink. In addition, a three-dimensional numerical model has been developed and validated with experimental data in terms of heat sink pressure drop and the temperatures of the heaters. 

The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly as a result of evolving technological trends and rising demand for online services, which has led to an increase in the amount of waste heat generated by IT equipment. Through the implementation of hybrid air and liquid cooling technologies, targeted, on-demand cooling is made possible by employing a variety of techniques, which include but are not limited to in-row, overhead, and rear door heat exchanger (HX) cooling systems. One of the most common liquid cooling techniques will be examined in this study based on different conditions for high-power density racks (+50 kW). This paper investigates the cooling performance of a liquid-to-air in-row coolant distribution unit (CDU) in test racks containing seven thermal test vehicles (TTVs) under various conditions, focusing on cooling capacity and HX effectiveness under different supply air temperatures (SAT). This test rig has the necessary instruments to monitor and analyze the experiments on both the liquid coolant and the air sides. Moreover, another experiment is conducted to assess the performance of the CDU that runs under different control fan schemes, as well as how the change of the control type will affect the supply fluid temperature and the TTV case temperatures at 10%, 50%, and 100% of the total power. Finally, suggestions for the best control fan scheme to use for these systems and units are provided at the conclusion of the study. 

The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air-cooling systems, while widely adopted, are reaching their limits in handling the rising thermal footprints and higher rack power densities of next-generation servers, often resulting in thermal throttling and decreased efficiency, emphasizing the need for more efficient cooling solutions. Direct-to-chip liquid cooling with cold plates has emerged as a promising solution, providing efficient heat dissipation for high-performance servers. However, challenges remain, such as ensuring system stability under varying thermal loads and optimizing integration with existing infrastructure. This comprehensive study digs into the area of data center liquid cooling, providing a novel, comprehensive experimental investigation of the critical steps and tests necessary for commissioning coolant distribution units (CDUs) in direct-to-chip liquid-cooled data centers. It carefully investigates the hydraulic, thermal, and energy aspects, establishing the groundwork for Liquid-to-Air (L2A) CDU data centers. A CDU’s performance was evaluated under different conditions. First, the CDU’s maximum cooling capacity was evaluated and found to be as high as 89.9 kW at an approach temperature difference (ATD) of 18.3 ◦C with a 0.83 heat exchanger effectiveness. Then, to assess the cooling performance and stability of the CDU, a low-power test and a transient thermohydraulic test were conducted. The results showed instability in the supply fluid temperature (SFT) caused by the oscillation in fan speed at low thermal loads. Despite this, heat removal rates remained constant across varying supply air temperatures (SATs), and a partial power usage effectiveness (PPUE) of 1.042 was achieved at 100 % heat load (86 kW) under different SATs. This research sets a foundation for improving L2A CDU performance and offers practical insights for overcoming current cooling limitations in data centers. 

In response to the exponential growth of online platforms and the rise of web-based Artificial Intelligence (AI), the demand for computational power and the expansion of data centers have surged significantly. This trend necessitates advanced cooling strategies and heightened energy efficiency to address the increasing power densities of Information Technology (IT) equipment and the consequent rise in energy consumption. Consequently, there is a significant pivot towards efficient cooling mechanisms that emphasize thermal management and energy efficiency. Against this backdrop, our study thoroughly evaluates a two-phase direct-to-chip liquid cooling system's ability to effectively manage and dissipate heat in high-density rack environments. Central to our research is the deployment of a highly efficient Refrigerant-to-Liquid (R2L) Coolant Distribution Unit (CDU) across multi-racks, which face high thermal demands. This innovative system, featuring an in-row pumped two-phase CDU with a cooling capacity of 160 kW, is intricately integrated with row and rack manifolds and server cooling loops to ensure optimal cooling performance. To accurately simulate the thermal loads encountered in real-world data center operations, the study employs Thermal Testing Vehicles (TTVs). These 3U TTVs are equipped with 2.5 kW heaters, covering an extensive area of 2500 mm², thereby effectively replicating server thermal loads up to 10 kW. The investigation starts with a detailed description of the system's design and continues with the commissioning process. This process includes extensive hydraulic and thermal testing, along with a comprehensive assessment of the impact of pressure drops across the system, focusing on supply manifolds, cooling loops, dry breaks, and return manifolds, utilizing Cooling Loops (CLs) each containing four Cold Plates (CPs). The study culminates in the analysis of experimental data from heating the TTVs, focusing on the efficiency of two-phase cooling in transferring heat from the TTVs to chilled water using R134a refrigerant as the performance benchmark. Future directions include exploring eco-friendly cooling practices by investigating alternative green refrigerants with low Global Warming Potential (GWP) to replace R134a, aligning with global sustainability goals and the imperative to reduce greenhouse gas emissions. The observed maximum values were calculated at a specific volumetric flow rate of 0.48 LPM/kW and a Tcase as low as 56.4 °C was achieved. These results demonstrate the system's capability to significantly enhance thermal management in data centers, tackle the challenges presented by high-power density chips, and encourage broader adoption of two-phase cooling technologies as a sustainable strategy for thermal regulation in the face of increasing computational demands. 

The escalating information technology (IT) loads in modern data centers (DCs) present formidable challenges for traditional room-conditioning systems. The heat dissipated from IT equipment has witnessed a significant surge due to the rapid development of data processing, retrieval, and storage, driven by changing technology trends and the growing demand for online services. This evolving landscape poses a substantial burden on air-cooling systems, pushing them to their limits, especially with the prevailing trend of rising power densities in microprocessors and the emergence of hot spots. Amidst these challenges, singlephase cold plate cooling is gaining traction as IT power densities experience a dramatic climb. However, the widespread adoption of this cooling method faces impediments such as the limited availability of chilled water supplies, constrained air distribution pathways, and the absence of elevated floors in many older DCs. In response to these limitations, liquid-to-air (L2A) cooling distribution units (CDUs) have emerged as an alternative method. By incorporating hybrid air and liquid cooling technologies, the industry aims to achieve precise, ondemand cooling through the utilization of various techniques. In the realm of hybrid cooling systems that integrate both air and liquid cooling technologies, a partial failure of the Computer Room Air Handlers (CRAH) introduces unique challenges. Such a failure has the potential to disrupt the delicate balance between air and liquid cooling components, leading to uneven heat dissipation. Moreover, the interdependence of liquid and air cooling in hybrid systems means that even a partial failure can trigger a domino effect, reducing the overall cooling efficiency of the system. This comprehensive study delves into the implications of partial failure in the CRAH unit within the highpower density racks of a hybrid-cooled DC. The investigation explores how this partial failure impacts various critical parameters, including cooling capacity (CC), supply air temperature (SAT), air flow rate, supply fluid temperature (SFT), and thermal testing vehicle (TTV) heater case temperatures. For the purposes of this study, two L2A in-row CDUs were utilized, with a combined total heat load of 129 kW supplied to three racks. The experimental setup is meticulously equipped with the necessary instruments for monitoring and assessing tests on both the liquid coolant and air sides. By addressing these issues, the research contributes valuable insights to the ongoing efforts to optimize data center cooling solutions in the face of evolving IT demands and technological advancements. 

Owing to the dramatic increase in IT power density and energy consumption, the data center (DC) sector has started adopting thermally- and energy-efficient liquid cooling methods. This study examines a single-phase direct-to-chip liquid cooling approach for three high-heat-density racks, utilizing two liquid-to-air (L2A) cooled coolant distribution units (CDUs) and a combined total heat load of 128 kW. An experimental setup was developed to test different types of CDUs, cooling loops, and thermal testing vehicles (TTVs) for different operating conditions. IR images and the collected data were used to investigate the effect of air recirculation between cold and hot aisle containments on the CDU’s performance and stability of supply air temperature (SAT). Three different types of cooling loops (X, Y, and Z) were characterized thermally and hydraulically. Results show that Type Y has the lowest cold plate thermal resistance and pressure drop, among others. In a later test that included a single rack at a heat load of 53 kW and a single CDU, the heat capture ratio for fluid was found to be 94%. Experiments show that using blanking panels on the back of the racks limits hot air recirculation and maintains a steady SAT in the cold aisle. Finally, the CDU performance was evaluated at a high heat load for the three racks at 128 kW, and the average cooling capacity of the units is 58.6 kW, and the effectiveness values for CDU 1 and CDU 2 are 0.83 and 0.82, respectively. 

Semiconductor thermal management is becoming a bottleneck challenge that restricts further development in the electronics industry. Compromising processor thermal requirements will impact the processor performance and reliability. Heat sinks are designed to increase the available surface area of an electronic component and allow for more heat to be easily dissipated. As a result, the thermal characterization of the heat sinks plays a critical role in electronics thermal management. In this study, a flexible experimental apparatus is designed, built, and assembled to characterize and test various electronics components in different aerodynamics and thermal conditions. This novel experimental apparatus allows for controlled characterization of the various heat sinks with different heights as well as realistic scenarios with air bypass at server level. Moreover, a general guideline on precise experimental procedure to characterize air cooled heat sinks is developed. The results show that introduced method reduces the experimental error by 26%. 

More than ever before, data centers must deploy robust thermal solutions to adequately host the high-density and high-performance computing that is in high demand. The newer generation of central processing units (CPUs) and graphics processing units (GPUs) has substantially higher thermal power densities than previous generations. In recent years, more data centers rely on liquid cooling for the high-heat processors inside the servers and air cooling for the remaining low-heat information technology equipment. This hybrid cooling approach creates a smaller and more efficient data center. The deployment of direct-to-chip cold plate liquid cooling is one of the mainstream approaches to providing concentrated cooling to targeted processors. In this study, a processor-level experimental setup was developed to evaluate the cooling performance of a novel computer numerical control (CNC) machined nickel-plated impinging cold plate on a 1 in.  1 in. mock heater that represents a functional processing unit. The pressure drop and thermal resistance performance curves of the electroless nickel-plated cold plate are compared to those of a pure copper cold plate. A temperature uniformity analysis is done using compuational fluid dynamics and compared to the actual test data. Finally, the CNC machined pure copper one is compared to other reported cold plates to demonstrate its superiority of the design with respect to the cooling performance. 

Abstract An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design changes: forward versus backward curved with peak static efficiencies of 60% and 75%, respectively, which results in operation power savings. The side effects of which are not fully understood. Therefore, it has become necessary to develop an overall understanding of backward curved blowers and compare the resulting flow, pressure, and temperature fields with forwarding curved ones in which the induced fields are characterized, compared, and visualized in a reference data center which may aid data center planning and operation when making the decisions of which computer room air handler (CRAH) technology to be used. In this study, experimental and numerical characterization of backward curved blowers is introduced. Then, a physics-based computational fluid dynamics model is built using the 6sigmaroom tool to predict/simulate the measured fields. Five different scenarios were applied at the room level for the experimental characterization of the cooling units and another two scenarios were applied for comparison and illustration of the interaction between different CRAH technologies. Four scenarios were used to characterize a CRAH with backward curved blowers, during which a CRAH with forwarding curved was powered off. An alternate arrangement was examined to quantify the effect of possible flow constraints on the backward curved blower's performance. Then parametric and sensitivity of the baseline modeling are investigated and considered. Different operating conditions are applied at the room level for experimental characterization, comparison, and illustration of the interaction between different CRAH technologies. The measured data is plotted and compared with the computational fluid dynamics (CFD) model assessment to visualize the fields of interest. The results show that the fields are highly dependent on CRAH technology. The tile to CRAH airflow ratios for the flow constraints of scenarios 1, 2, 3, and 4 are 85.5%, 83.9%, 61%, and 59%, respectively. The corresponding leakage ratios are 14.5%, 16%, 38.9%, and 41%, respectively. Furthermore, the validated CFD model was used to investigate and compare the airflow pattern and plenum pressure distribution. Lastly, it is notable that a potential side effect of backward curved technology is the creation of an airflow dead zone.