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Abstract GeSn photodetectors monolithically grown on Ge virtual substrates demonstrate mid‐wave infrared (MWIR) detection at room temperature. The lattice mismatch between GeSn and Ge causes dislocations and compressive strain, creating leakage pathways and unwanted indirect band transitions. Designed thin Ge_0.91Sn_0.09triple‐step buffer layers of ≈175 nm total thickness reduce dislocations and enable full relaxation, showing 100% lattice relaxation and smooth surface roughness of 0.83 nm with shorter auto‐correlation length in surface morphology compared to single‐step buffers. Ge_1‐xSn_xphotodetectors (x= 0.09, 0.12, and 0.15) on triple‐step buffers withn‐i‐pconfigurations achieve lattice strain relaxations of 99%, 88%, and 80%, respectively. Ge_0.91Sn_0.09and Ge_0.88Sn_0.12show gradual variation in auto‐correlation amplitude, while Ge_0.85Sn_0.15shows an increase due to lattice mismatch. Shockley–Read–Hall recombination current dominates at low reverse bias due to mismatch‐induced dislocations, while band‐to‐band tunneling current dominates at higher reverse bias due to narrowing bandgap under strong electric fields. The photodetectors show extended spectral response with increasing Sn composition ofi‐GeSn active layer sandwiched by barriers. Ge_0.88Sn_0.12and Ge_0.85Sn_0.15exhibit extended wavelength cut‐offs of 3.12 and 3.27 µm at room temperature, demonstrating significant potential for silicon‐based MWIR applications. 

Abstract In this work, TiO₂thin films deposited by the atomic layer deposition (ALD) method were treated with a special N₂O plasma surface treatment and used as the gate dielectric for AlGaN/GaN metal insulator semiconductor high electron mobility transistors (MISHEMTs). The N₂O plasma surface treatment effectively reduces defects in the oxide during low-temperature ALD growth. In addition, it allows oxygen atoms to diffuse into the device cap layer to increase the barrier height and thus reduce the gate leakage current. These TiO₂films exhibit a dielectric constant of 54.8 and a two-terminal current of 1.96 × 10⁻¹⁰A mm⁻¹in 2μm distance. When applied as the gate dielectric, the AlGaN/GaN MISHEMT with a 2μm-gate-length shows a high on/off ratio of 2.59 × 10⁸and a low subthreshold slope (SS) of 84 mV dec⁻¹among all GaN MISHEMTs using TiO₂as the gate dielectric. This work provides a feasible way to significantly improve the TiO₂film electrical property for gate dielectrics, and it suggests that the developed TiO₂dielectric is a promising high-κgate oxide and a potential passivation layer for GaN-based MISHEMTs, which can be further extended to other transistors. 

In this paper, we design and analyze the conforming and nonconforming virtual element methods for the Signorini problem. Under some regularity assumptions, we prove optimal order a priori error estimates in the energy norm for both two numerical schemes. Extensive numerical tests are presented, verifying the theory and exploring unknown features. 

Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS) is a powerful technique for elemental compositional analysis and depth profiling of materials. However, it encounters the problem of matrix effects that hinder its application. In this work, we introduce a pioneering ToF-SIMS calibration method tailored for SixGeySnz ternary alloys. SixGe1-x and Ge1-zSnz binary alloys with known compositions are used as calibration reference samples. Through a systematic SIMS quantification study of SiGe and GeSn binary alloys, we unveil a linear correlation between secondary ion intensity ratio and composition ratio for both SiGe and GeSn binary alloys, effectively mitigating the matrix effects. Extracted relative sensitivity factor (RSF) value from SixGe1-x (0.07<0.83) and Ge1-zSnz (0.066<0.183) binary alloys are subsequently applied to those of SixGeySnz (0.011<0.113, 0.863<0.935 and 0.023<0.103) ternary alloys for elemental compositions quantification. These values are cross-checked by Atom Probe Tomography (APT) analysis, an indication of the great accuracy and reliability of as-developed ToF-SIMS calibration process. The proposed method and its reference sample selection strategy in this work provide a low-cost as well as simple-to-follow calibration route for SiGeSn composition analysis, thus driving the development of next-generation multifunctional SiGeSn-related semiconductor devices.