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Abstract Micro light emitting diodes (MicroLEDs) provide unrivaled luminance and operating lifetime, which has led to significant activity using devices for display and non‐display applications. The small size and high power density of microLEDs, however, causes increased adverse heating effects that can limit performance. A new generation of electrically insulating high thermal conductivity materials, such as alumina, is proposed to mitigate these thermal effects when used as a substrate as an alternative to glass. This strategy can then be used as a method of passive heat sinking to improve the overall performance of the microLED. In this work, a newly available material, an 80 micron thick alumina ceramic substrate, is shown to yield a 30 % improvement on average in the maximum current drive over a glass substrate. 

Abstract Ultrahigh‐resolution micro light‐emitting diode (LED) displays are emerging as a viable technology for self‐emissive displays. Several of the critical issues facing micro LED displays with millions of pixels are fidelity, process control, and defect analysis during LED fabrication and transfer. Here, we investigate two non‐destructive test methods, photoluminescent and cathodoluminescent imaging, and compare them with electroluminescent images to verify LED fidelity and evaluate these methods as potential tools for defect analysis. We show that utilizing cathodoluminescent imaging as an analysis tool provides a rich data set that can identify and categorize common defects during micro LED display fabrication that correspond to electroluminescence. Photoluminescent imaging, however, is not an effective method for fidelity analysis but does provide information on dry‐etching uniformity. 

Optical sectioning structured illumination microscopy (OS-SIM) provides optical sectioning capability in wide-field microscopy. The required illumination patterns have traditionally been generated using spatial light modulators (SLM), laser interference patterns, or digital micromirror devices (DMDs) which are too complex to implement in miniscope systems. MicroLEDs have emerged as an alternative light source for patterned illumination due to their extreme brightness capability and small emitter sizes. This paper presents a directly addressable striped microLED microdisplay with 100 rows on a flexible cable (70 cm long) for use as an OS-SIM light source in a benchtop setup. The overall design of the microdisplay is described in detail with luminance-current-voltage characterization. OS-SIM implementation with a benchtop setup shows the optical sectioning capability of the system by imaging within a 500 µm thick fixed brain slice from a transgenic mouse where oligodendrocytes are labeled with a green fluorescent protein (GFP). Results show improved contrast in reconstructed optically sectioned images of 86.92% (OS-SIM) compared with 44.31% (pseudo-widefield). MicroLED based OS-SIM therefore offers a new capability for deep tissue widefield imaging. 

MicroLEDs offer an extraordinary combination of high luminance, high energy efficiency, low cost, and long lifetime. These characteristics are highly desirable in various applications, but their usage has, to date, been primarily focused toward next-generation display technologies. Applications of microLEDs in other technologies, such as projector systems, computational imaging, communication systems, or neural stimulation, have been limited. In non-display applications which use microLEDs as light sources, modifications in key electrical and optical characteristics such as external efficiency, output beam shape, modulation bandwidth, light output power, and emission wavelengths are often needed for optimum performance. A number of advanced fabrication and processing techniques have been used to achieve these electro-optical characteristics in microLEDs. In this article, we review the non-display application areas of the microLEDs, the distinct opto-electrical characteristics required for these applications, and techniques that integrate the optical and electrical components on the microLEDs to improve system-level efficacy and performance. 

Micro light-emitting diode (microLED) structures were modeled and validated with fabricated devices to investigate p-type GaN (pGaN) contact size dependence on power output efficiency. Two schemes were investigated: a constant 10μm diameter pGaN contact and varying microLED sizes and a constant 10μm diameter microLED with varying contact sizes. Modeled devices show a 17% improvement in output power by increasing the microLED die size. Fabricated devices followed the same trend with a 70% improvement in power output. Modeled microLED devices of a constant size and varying inner contact sizes show optimized power output at different current densities for various contact sizes. In particular, lower current densities show optimized output for smaller pGaN contacts and trend towards larger contacts for higher current densities in a balance between undesirable efficiency losses at high-current injection and preventing surface recombination losses. We show that for all device geometries, it is preferential to shrink the pGaN contact to maximize efficiency by suppressing surface recombination losses and further improvements should be carefully considered to optimize efficiency for a desired operational brightness.