Forecasting data center cooling demand remains a primary thermal management challenge in an increasingly larger global energy-consuming industry. This paper proposes a dynamic modeling approach to evaluate two different strategies for delivering cold air into a data center room. The common cooling method provides air through perforated floor tiles by means of a centralized distribution system, hindering flow management at the aisle level. We propose an idealized system such that five overhead heat exchangers are located above the aisle and handle the entire server cooling demand. In one case, the overhead heat exchangers force the airflow downwards into the aisle (Overhead Downward Flow (ODF)); in the other case, the flow is forced to move upwards (Overhead Upward Flow (OUF)). A complete fluid dynamic, heat transfer, and thermodynamic analysis is proposed to model the system’s thermal performance under both steady state and transient conditions. Inside the servers and heat exchangers, the flow and heat transfer processes are modeled using a set of differential equations solved in MATLAB™. This solution is coupled with ANSYS-Fluent™, which computes the three-dimensional velocity, temperature, and turbulence on the Airside. The two approaches proposed (ODF and OUF) are evaluated and compared by estimating their cooling effectiveness andmore »
The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle
The most common approach to air cooling of data centers involves the pressurization of the plenum beneath the raised floor and delivery of air flow to racks via perforated floor tiles. This cooling approach is thermodynamically inefficient due in large part to the pressure losses through the tiles. Furthermore, it is difficult to control flow at the aisle and rack level since the flow source is centralized rather than distributed. Distributed cooling systems are more closely coupled to the heat generating racks. In overhead cooling systems, one can distribute flow to distinct aisles by placing the air mover and water cooled heat exchanger directly above an aisle. Two arrangements are possible: (i.) placing the air mover and heat exchanger above the cold aisle and forcing downward flow of cooled air into the cold aisle (Overhead Downward Flow (ODF)), or (ii.) placing the air mover and heat exchanger above the hot aisle and forcing heated air upwards from the hot aisle through the water cooled heat exchanger (Overhead Upward Flow (OUF)). This study focuses on the steady and transient behavior of overhead cooling systems in both ODF and OUF configurations and compares their cooling effectiveness and energy efficiency. The flow and more »
- Award ID(s):
- 1738782
- Publication Date:
- NSF-PAR ID:
- 10058026
- Journal Name:
- ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
- Page Range or eLocation-ID:
- V001T09A023
- Sponsoring Org:
- National Science Foundation
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